How Technology Benefits Chips and Chiplets

How Technology Benefits Chips and Chiplets

Technology presents the semiconductor industry with new opportunities to fix incompetencies.

FREMONT, CA: The semiconductor industry is currently in the middle of a significant surge. Propelled by the demands from electronic manufacturers, semiconductors chips are attaining new levels of sophistication and functionality. However, the semiconductor industry is still trying to overcome certain limitations. Several aspects of semiconductors, including memories, packaging, and transistors, require substantial improvement. To successfully address these challenges, semiconductor companies will have to find relevant technological breakthroughs. Some aspects of semiconductors that need attention are enlisted below.  

Improving Core Elements in Chips

The structure and function of all the core elements in a chip can be altered to develop better operational properties. Transistors and interconnects, which are two vital parts of a modern chip, have scope for improvement. Currently, there exist challenges in the layer between the transistors and interconnect. One way of surmounting this challenge is by adopting the emerging Extreme Ultraviolet (EUV) technology for lithography. EUV allows significant simplifications when compared with the traditional lithography used now. Apart from that, a change in the material of interconnects can also deliver better results.

Evolved Architectures

The technological landscape has evolved, and this entails the evolution of chip architecture as well. Traditional architectures should be replaced with new, innovative architecture that supports the expanding functionalities of chips. With new architecture that leverages AI and big data, chip-makers will be able to address power and performance while bringing down costs. The opportunities for intervention also lie in the use of new materials. The evolved architecture will support diverse applications and contribute to making chips energy efficient.

Advanced Packaging

Packaging technology is becoming increasingly crucial today. The traditional ways of chip scaling is resulting in high expenses. Thus, chip-makers are now in the hunt for better alternatives and advanced package. Modular chiplets have the potential to deliver better results and make specialization at scale possible. Since there exist specialized nodes for particular functionalities like power delivery and memory, the prospects of improved performance are high.

In upgrading the semiconductors with technological interventions, chip-makers will be able to discover new avenues for business and overcome the traditional challenges associated with semiconductor chip production today.

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