Weekly Brief


Weekly Brief

Thursday, February 27,2020

Feature of the Week

Appropriate usage of data can help make chip design processes as sophisticated as the chips themselves.  Read more
Data centers can now future-proof themselves by incorporating chips that deliver the pliability they have within the end of the day.  Read more
With the emergence of encapsulation technology, the ultra-thin semiconductor is now a reality.  Read more


By Joe Tenczar, CIO & Partner, 3CIOs  
I learned long ago that if you don’t understand “why” something is being done, you have little chance of succeeding.  Read more
By Jeremy Campbell, CIO, Electric Power Research Inst  
Digitalization offers benefits to almost every area of business, and digital ideas come from all over.  Read more

Featured Vendors

By William Amelio, CEO,   
A global leader in electronic components and embedded solutions from design to delivery  Read more
By Zoran Stankovic, CEOViktor Dogan, CTO,   
Provides ready-made design solutions in the area of IoT, environmental sensing, motion sensing and analytics  Read more
By John Fayos, President, Dave Rice, VP of Engineering, Omar Rahim, VP Marketing, Thomas Catalino, VP Sales,   
Provides embedded systems and services to help customers bring products to market more rapidly and at a lower cost  Read more

CXO Insights

By Steven P. Nelson, Executive Director, IOT Freescale Semiconductor  
In the rush to connect all kinds of devices, we run the real risk of compromising on security and privacy that can slow the growth of truly valuable products and services.  Read more
By Dr. Ajay Sattu, Sr. Manager, Automotive Strategic Marketing, Amkor Technology, Inc.  
While there is a high demand for traceability, the biggest challenge remains in identifying the protocols for manufacturing data across the supply chain.  Read more