Semiconductor Review: Weekly Brief

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Weekly Brief

Oct 8, 2026

Featured Vendors

Lightmatter: Reengineering AI Infrastructure through Photonic Computing
Steve Klinger, VP of Ecosystem and Strategic Alliance   
Lightmatter develops photonic computing and co-packaged optics technologies for AI infrastructure environments. The company combines photonic interconnects, integrated optical engines and scalable semiconductor architectures to help hyperscale...  Read more ►
WITTENSTEIN high integrity systems Ltd.: Certification-Ready Software for a Changing Embedded World
Andrew Longhurst, Managing Director   
WITTENSTEIN high integrity systems Ltd. enables the future of safety-critical embedded systems with SAFERTOS®, providing certification-ready software, engineering assurance, and functional safety expertise. The company helps automotive,...  Read more ►

Industry Contributors

The Road Ahead for Semiconductors
By Joseph Cestari, Vice President, Semiconductor Operations, ABM Industries  
The semiconductor industry has always been defined by constant change, but its latest transformation has surpassed what even industry veterans could have predicted.  Read more ►
Building Brands Through Cultural Relevance
By Hilary Neve, Global Head of Partnerships & Brand Communications, SharkNinja  
Hilary Neve is a communications and marketing executive known for shaping strategic direction and advising C-suite leaders on building and scaling leading technology and AI companies.  Read more ►
Agility by Design: How HR Leaders Build Nimble Organizations
By Sheri Harpe, SVP, Chief People Officer (CPO) | Enterprise Operations & Administration Leadership, Tire Discounters  
Markets shift overnight. Customer expectations evolve faster than annual planning cycles. Entire business models can be disrupted in a matter of months.  Read more ►

Feature of the Week

IC Package Analysis: Improving Performance Through Predictive Design
Semiconductor packaging is now playing a key role in realizing the electrical, thermal and mechanical performance desired for modern electronic systems.  Read more ►
Connecting IC Package Design To System-Level Analysis
Advanced IC packages compress more electrical behavior into less physical space while spreading design responsibility across die-to-substrate interfaces and the broader system.  Read more ►
Stable IC Handling under Rising Complexity
 Read more ►