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Winonics has been recognized by Semiconductor Review Magazine as “Top 10 Micro Electronics Solutions Companies - 2023” based on our proprietary methodology, reflecting its position in the industry. This profile has been developed by the Semiconductor Review research and editorial team based on insights from an interview with Sidali Koulougli, General Manager.
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“Winonics is the alternative to larger corporations, offering unparalleled flexibility and adaptability. By virtue of our small yet adaptable operations, we deliver quick turnaround times, which are usually three, five, or seven days,” says Richeal Klepach, Sales Manager at Winonics.
The firm’s investment in state-of-the-art equipment over the past few years has enhanced its capabilities, positioning it as a reliable ally in the industry. Winonics, now under ACT’s wing, specializes as a comprehensive provider of advanced PCBs. ACT’s expertise in developing unique solutions for ultra-high-density interconnect (UHDI) circuits has bolstered Winonics’ capabilities. These flexible PCBs are utilized across diverse sectors, including aerospace, defense, and industrial instrumentation. Winonics excels in offering design for manufacturability (DFM) services, which combine engineering finesse with industry-leading turnaround times for various PCBs like rigid, rigid-flex and flex. Its expertise in UHDI circuitry effectively tackles the complexities of miniaturization. The firm is gradually expanding its capabilities from a 25-micron scale to an ambitious 12-and-a-half-micron.
The collaboration between Winonics and ACT has led to the development of its proprietary Additive Circuit Technology System (ACTS)—a patented, semi-additive and modified semi-additive process that is an innovative response to the UHDI market demands.
Winonics plays a pivotal role in guiding clients through this intricate process. Its dedicated research and development teams provide comprehensive support, ensuring that various client requirements are met. Predominantly serving the aerospace and defense sectors, Winonics has carved out a position for itself by providing cutting-edge engineering solutions and advanced processing capabilities. Product applications include Radio Frequency through Millimeter Wave transmissions, Ultra-High-Density Interconnects to support ultra-fine pitch BGA devices, Waveguide structures, and planar and non-planar Antennas.
From the management team to the machine operators, every company member shares a deep commitment to developing high-quality products and fostering high-yield operations.
Winonics’ commitment to customer service is evident in its industry-leading response times, which provide round-the-clock support throughout the product realization and manufacturing process. Open lines of communication are maintained as a fundamental aspect of its customer engagement strategies. Inquiries and requests are promptly addressed, emphasizing the firm’s focus on delivering best in class customer service and satisfaction.
Manufacturing PCBs for over five decades now, Winonics, along with Additive Circuits Technologies, has established a proud legacy of exceptional service, innovative solutions with no boundaries enabling them to deliver on-time quality PCBs. As the microelectronics industry moves towards an era marked by increasing investments, a shift to advanced technology nodes, and the rise of contemporary technologies, this rich history and ongoing pursuit of technological excellence will ensure that Winonics remains a reliable partner in transforming novel ideas into realities.
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Company
Winonics
Management
Sidali Koulougli, General Manager and Richeal Klepach, Sales Manager; Gary Abel, Director of Operations.
Description
Winonics specializes in custom solutions for ultra-high-density interconnect (UHDI) designs. It offers design for manufacturability (DFM) services coupled with engineering expertise underpinned by industry-leading turnaround times for rigid, rigid-flex and flex printed circuit boards (PCBs).