TSE
Manufacturers of Probe Cards, TIB, and Test Socket Technologies

The semiconductor industry holds a position of paramount importance and complexity within the global economy as it experiences growing demand for superior chips and wafers. Within this industry, the inspection process assumes a critical role in identifying and classifying defects throughout the production phase.

Incorporating an effective semiconductor inspection process can yield significant cost reductions and enhance the overall quality of products for companies. TSE, a specialized enterprise dedicated to developing and producing cutting-edge probe cards, package test interface boards (TIB), and test socket technologies, emerges as a key player in this endeavor.

TSE’s innovative solutions predominantly find application in the wafer and package test processes, constituting an essential component of the semiconductor production cycle. Lever aging their expertise and state-of-the-art technologies, TSE empowers semiconductor companies to maintain a competitive edge, ensuring their products adhere to the highest standards of quality and reliability.

“We have a business structure that creates mutual synergy with representative semiconductor inspection devices such as probe card, TIB, and test socket technology,” says SJ Kwon, chairman of TSE.

TSE exhibits a robust business structure characterized by a notable degree of internalization and vertical integration of key components. This strategic approach enables the company to offer turnkey solutions and convergence products to its clientele, delivering value through enhanced convenience and expedited processes.

One of TSE’s stand out offerings is the Test Interface Board (TIB), which plays a pivotal role in electrical quality inspection after the packaging stage. Since its inception in 1994, the TIB has garnered significant acclaim from major memory semiconductor manufacturers in Korea, including industry giants like Samsung and SK Hynix. Moreover, TSE has made remarkable strides in the non-memory market since 2010, catering to the global demand of CPU/GPU and chipset companies.

Lever aging its micro-electromechanical systems (MEMS) process and ultra-high-speed bonding technology, TSE produces ultra-precision probes for the DRAM/Flash Memory probe card—a vital test interface product for the electrical testing of semiconductor wafers. The company can mass-produce high pin count probe cards, facilitating the bonding of over 100,000 probes to accommodate diverse market requirements. Much like the comprehensive solution provided by the TIB, TSE assumes end-to-end responsibility, encompassing design, manufacturing, assembly, and inspection processes. Furthermore, TSE mass-produces a non-memory vertical probe card featuring a 60um dimension, lever aging its MEMS process to meet various market demands and specifications.

TSE has made significant strides in semiconductor chiplet die and package testing, particularly in cases necessitating HSIO ports. To address this need, the company has introduced the ELTUNE-coaxTM test socket, a pioneering solution featuring a unique coaxial structure employing a metal frame—a world-first achievement. Complementing this innovation is the Tango PinTM Socket, which boasts superior CCC characteristics while minimizing the idle time of costly ATE equipment. With its convenient and efficient maintenance capabilities and replaceable contact parts, the Tango PinTM Socket presents a cost-effective proposition. Next comes the Chiplet Contact Carrier which is used for testing chiplet die below 100um pitch. Applying this solution, tens of millions of dollars of investment expense for chiplet die test could be saved by using the existing ATE, Burn-In Testers.

The OLED Display Panel Tester, designed by TSE, is a comprehensive tool for understanding the characteristics exhibited by each pixel within OLED panels. Additionally, TSE’s Array Tester and Touch Tester are crucial in extracting essential electrical characteristic data from each pixel, facilitating precise detection and inspection of their properties.

TSE has established itself as a prominent semiconductor and display panel inspection solutions provider, lever aging its TSE MEMS technology to deliver high-speed testing capabilities of up to 40GHz. The company has achieved significant success in the semiconductor sector by employing its MEMS technology to support customers in two notable cases. Firstly, TSE collaborated on developing a loop back component, effectively reducing the high-speed test costs for a prominent CPU customer and resulting in substantial savings of millions of dollars in inspection expenses.

In another instance, TSE addressed the concerns of an automotive customer regarding the absence of a ‘high-speed SerDes test solution.’ By developing a test solution utilizing TSE’s components, the customer emerged as a technological leader in the automotive market, significantly increasing their market share.

Having dedicated three decades to the inspection field, TSE stands prepared for the future of the semiconductor and display panel test industries, forged by deep mutual trust with its global clientele and a strong track record of conquering challenges together. The company is resolute in its pursuit of becoming the industry standard for semiconductor testing while simultaneously creating value for customers by spearheading test equipment standards and fostering innovation within the OLED/LCD panel test market.