Kenichiro Yoshioka, President
The number of transistors on a microchip double about every two years, though the cost of computers is halved. - Moore’s Law
Though Moore’s Law has achieved significant breakthroughs in the semiconductor space, the miniaturization of technology has reached its eventual limit. But, innovators have once again pulled up their sleeves to circumvent this technology hurdle. Advanced packaging solutions—one of the innovative resolutions to this conundrum—have allowed manufacturers to transcend such technological limitations and achieve efficiencies that were previously deemed unattainable. One of the pioneers validating this proposition through an equally ground-breaking technological portfolio is Teikoku Taping System (TTS).
“TTS works on creating a total solution. This means we handle multiple processes and integrate with ancillary equipment and materials to meet our customer’s needs,” says Kenichiro Yoshioka, President, Teikoku Taping System. For over a quarter of a century, TTS has been creating customized solutions to address varied customer requirements through its ‘Haru, Hagasu, and Hakobu’ technologies, catering to major semiconductor foundries primarily in Taiwan and several customers around the world. As implied in its name, the company offers taping solutions with backgrinding tape applications, peeling and UV irradiation, alongside its dry film, resist application, and more, which provide clients with a wide gamut of value propositions in their manufacturing ventures.
Likewise, the company excels at lamination, wafer/substrate mounting, bonding, and debonding equipment.
Leaders at TTS firmly believe in the idea of working closely with material partners and equipment manufacturers while developing a certain process in a collaborative effort. Such a work culture ensures that clients need not actively seek out various pieces of their manufacturing puzzle but rather focus on their workflow’s much more value-driven aspects. The customizability of its solutions, clubbed a sense of flexibility to understand clients’ necessities, sets TTS leagues apart from its competition. For instance, in addressing one such requirement, TTS developed substrate processing tools to complement its wafer-based equipment line-up. In another example, the company solved lamination concerns for a client involving the ‘polymer cap method,’ which was later commonly used for SAW devices. This engagement quite literally positioned TTS’ laminators as the industry standard and an essential piece of the low-profile technology used in SAW devices.
TTS works on creating a total solution. This means we handle multiple processes and integrate with ancillary equipment and materials to meet our customer’s needs
Likewise, the patents filed by the company to safeguard its intellectual property speaks volumes of its excellence in the semiconductor manufacturing space. TTS’ digitally controlled bumper table enables the manufacturer to vary the lamination height, leading to superior Dry Film Resist tenting applications. Another noteworthy patent relates to the company’s ability to machine/cut the inner circumference of wafers and prevent the ‘gumming up’ phenomenon associated with blades. That said, TTS’ technological proficiency is just one component of its success in the industry. The second component and equally important aspect is the company’s approach to such engagements. Mr Yoshioka and team work with both material and equipment—termed the alliance approach— benefitting from its parent company Nippon Kayaku and several other manufacturers to provide a true total solution to clients.
In a world where tape manufacturers and equipment providers are extremely rigid in changing tool specification, TTS differentiates itself by the customization of its technological portfolio and alliance approach. The merit of such a flexible, committed, and purpose driven work ethic, along with a ‘can do spirit’ to address any requirement posed by the client without a doubt, proves invaluable in the semiconductor space.