Setex Technologies
From Nature to Industry

Imagine developing a semiconductor adhesive capable of secure handling, precise alignment, protection, and efficient processing while allowing for bonding and repositioning. Conventional adhesives in this industry often leave residues, cause damage, and necessitate harsh removal methods, hindering efficiency and sustainability.

To overcome these limitations, researchers turned to nature's wisdom. Inspired by the gecko's remarkable feet, they discovered nanostructures called spatulae that enable the gecko to cling to smooth surfaces with extraordinary precision. The interaction forces at each contact point may be minuscule, but when multiplied across millions of points, they generate a powerful, attractive force.

This revelation led to the creation of gecko-inspired Setex^® products by Setex Technologies, co-founded by Dr. Metin Sitti and Dr. Burak Aksak.

"We decided to take this technology to the commercial realm and created a tunable, releasable, and residue-free adhesive to address challenges in the semiconductor industry that current adhesives and gripping materials cannot solve," says Burak Aksak, VP of Research at Setex Technologies.

These micro-fibrillar polymer-based dry adhesives function like tape, forming strong, residue-free bonds on smooth surfaces. They excel in industrial applications where low residue and reversibility are crucial, such as handling glass and silicon parts, processing semiconductor wafers, or temporary fixation of fragile substrates.

Precision handling of delicate wafers is of paramount importance. Setex’s micro-structured adhesive plays a crucial role in ensuring the stability of these wafers during rapid transport within wafer handling systems.

This innovative technology seamlessly blends formidable shear strength with low adhesion, resulting in residue-free and damage-free wafer movement.

Temporary bonding tape is an indispensable component in advanced packaging techniques, such as fan-out wafer-level packaging and three-dimensional stacking. Conventional adhesives based on pressure sensitive adhesives securely holds chips in place during assembly but tends to leave a residue and require methods such as laser ablation, UV exposure, or adhesive heating to remove. Setex's adhesive distinguishes itself by incorporating a press-to-release feature, streamlining the process and eliminating the need for post-cleaning.

The same technology extends to applications like mounting tape and back grinding tape, ensuring secure substrate retention while leaving no residue and offering minimal resistance to prevent damage.

Setex is distinct in how its technology does not rely on tacky, highly viscoelastic materials. In contrast to traditional pressure-sensitive adhesives, Setex's technology relies exclusively on surface-level intermolecular interactions such as van der Waals forces. This approach uses existing polymers and plastics rather than lowly cross-linked materials, resulting in flexibility in the choice of materials, extended shelf life and reusability.

Setex's adhesives are highly effective and environmentally responsible. They are reusable and can be easily cleaned with common solvents such as isopropyl alcohol or acetone for multiple uses, enhancing sustainability. Setex specializes in crafting custom-designed adhesive products tailored to meet the specific adhesion and peel requirements of the semiconductor industry without altering the material itself.

Recent research by Setex unveiled the remarkable effectiveness of one of its microstructured materials at elevated temperatures. It can be easily removed without leaving residue, promising significant impacts and new standards in various applications.