SeeDevice Inc.
Pioneer in QMOSTM (Quantum effect CMOS) SWIR Image Sensor Technology

For the past few decades, CMOS (complementary metal-oxide semiconductor) technology’s importance within the semiconductor industry has become abundantly clear. Limitations of silicon’s absorption properties, ranging from 400-1100 nanometers, have constrained CMOS image sensor’s performance. To expand beyond this range, many companies employ supplementary manufacturing techniques and materials that increase the overall cost.

SeeDevice, a fabless CMOS-SWIR (short wave infrared) image sensor company, offers a solution to these limitations with its QMOS^TM (Quantum effect CMOS) sensor. By combining quantum tunneling and plasmonics in a state-of-the-art CMOS mixed-signal integrated circuit, the company's QMOS^TM image sensor requires no additional processes or materials. The combination enables SeeDevice to outperform competing technologies, all while maintaining scalability and affordability.

"At SeeDevice we pioneer the CMOS-SWIR image sensor industry through innovation in quantum tunneling and plasmonic technology to provide unimaginable performance and capabilities with standard CMOS material and process which accelerates scalability," says Helen Lee, VP of Operations at SeeDevice.

The advanced sensor technology positions SeeDevice at the forefront of the industry, offering high sensitivity, nanosecond integration time, and wide dynamic range to provide unmatched performance for clients’ needs spanning across biomedical/biometric, automotive, security & surveillance, agriculture, and consumer products like mobile devices, personal computers, and machine vision enabled industrial applications.

Providing Sensors and Software Customization

Unlike its competitors, SeeDevice's image sensors do not require additional materials or processes, making them easily scalable to meet production needs without disrupting existing manufacturing processes. Key features that set SeeDevice apart include:

1. Ultra-Fast Integration Time: SeeDevice's QMOS^TM sensor provides image data at faster rates than existing sensors due to its nanosecond integration time, making it ideal for applications demanding rapid image capture. The design’s high sensitivity to wavelengths from UV to SWIR allows its absorbance with decreased noise levels, increasing the sensor's signal-to-noise ratio (SNR).

2. Outstanding Low and Bright Environment Performance: Due to QMOS^TM’s high dynamic range, the sensors are less affected by bright light sources, including headlights and sunlight, ensuring consistently clear and accurate image data. When compared to exotic materials like InGaAs (Indium Gallium Arsenide) and Black Silicon, its sensors' sensitivity remains higher even when venturing further into the light spectrum.

3. Wide Spectral Range: SeeDevice's sensors excel in low-light conditions, providing reliable performance in challenging environments. Since the quantum photodetector has a wider spectral range of 200-1650nm, it can detect UV to SWIR regions, granting customers unprecedented image data. Coupled with the quantum photodetector's fast integration time, the imager can provide imaging in low-light conditions in real time benefiting applications like machine vision systems that are consistently moving and require accurate imaging as quickly as possible.

Apart from performance and cost, SeeDevice also offers clients the ability to customize the software to meet and surpass their expectations.

In partnership with a global leader in agricultural technology, SeeDevice has demonstrated the superior dynamic range and sensitivity of its sensors in comparison with the client’s current technology. This development is poised to significantly improve the precision and accuracy of its machines in the harvesting and planting process.

In another case, a global manufacturing company recently approached SeeDevice for a cost-effective sensor with fast integration capabilities. After extensive discussions, they expressed keen interest in the company's sensors due to their affordability and performance standards, which, upon implementation, will undoubtedly improve their products' capabilities.

Committed to the Vision of a Smarter, More Connected World

To bolster its competitiveness, particularly in the LiDAR and ADAS (Advanced Driver-Assistance System) markets, SeeDevice has embarked on the development of cutting-edge 3D sensor technology.

Additionally, SeeDevice has developed a non-invasive continuous glucose monitoring (NI-CGM) device. This device promises to aid in reducing the financial burden on diabetics worldwide with its much lower cost of ownership compared to existing invasive types of CGM devices, making vital health information more accessible.

Having recently completed the first round of human trials with promising results, SeeDevice is confident in its ability to achieve a high level of accuracy. With plans to integrate machine learning algorithms, the device’s improved accuracy will meet the industry standards and allow for commercialization at a fraction of the cost.

SeeDevice is committed to the vision of a smarter, more connected world. Its image sensors are positioned as core technologies that will help shape the 4th Industrial Revolution. With increasing demand for CMOS sensors, the market is projected to reach over 30 billion USD by 2029, which SeeDevice is poised to penetrate and disrupt now that the sensor is ready for mass production.

As SeeDevice continues to lead the way in image sensing technology, its focus on innovation, affordability, and positive societal impact guides it toward pioneering the CMOS-SWIR image sensor industry through innovations in quantum sensing technology. The company's dedication to enhancing the capabilities of image sensors while ensuring accessibility promises a brighter future for industries and individuals worldwide.