OmniMeasure Technology Inc.
From Foundry to Future

OmniMeasure Technology Inc. is a promising Taiwanese startup poised to significantly impact the semiconductor industry with its cutting-edge technology for measuring through-silicon vias (TSVs). Formed out of the prestigious Industrial Technology Research Institute (ITRI), OmniMeasure provides advanced measurement solutions that enhance overall accuracy, efficiency and quality of semiconductor production.

A Testament to Precise Measurements

At the core of OmniMeasure’s offerings lies its flagship semiconductor processing inspection systems, designed to meet the intricate demands of TSV measurement in 3D ICs. These systems can measure TSV diameters under 5 microns with aspect ratios exceeding 30. This capability comes at a pivotal moment, aligning with imminent advancements in TSV structures anticipated over the next two to three years, positioning the company as a linchpin in the forthcoming shift within the semiconductor industry.

“We aspire to be a game-changer in the semiconductor industry, meeting the escalating need for precision measurement,” states Chao-Chang Chen, chairman at OmniMeasure. “In the past, the focus was on fabrication, but now precise measurement has become crucial, especially for mass production. Without precision, efficiency and quality suffer. The need for accurate measurement drives our innovation, leading the evolution of manufacturing,” he adds.

OmniMeasure’s measurement tools go beyond just precision, offering non-destructive and high-throughput assessments tailored for 12-inch wafers and other customized sizes. Its unparalleled accuracy ensures the integrity and performance of modern semiconductor devices, setting a new benchmark for quality assurance.

Besides, the seamless integration of OmniMeasure’s technology with existing process tools expedites production processes while amplifying throughput without compromising quality. This transformative capability streamlines operations and future-proofs manufacturing facilities, rendering the company an integral partner for semiconductor manufacturers.

Yet, OmniMeasure’s ambitions transcend the realm of TSV measurements alone. The company is venturing into through-glass via (TGV) measurements, poised to address the evolving demands in 3D packaging and high-performance computing. This strategic approach underscores OmniMeasure’s commitment to anticipating and meeting the semiconductor industry’s ever-evolving needs, further solidifying its status as an industry trailblazer.

OmniMeasure’s clients stand to reap substantial benefits from its advanced measurement technology. The precision in measuring smaller, high-aspect-ratio TSVs translates into faster, more reliable production cycles, amplifying overall production efficiency and quality control.

In addition, OmniMeasure’s strategic partnerships with local foundries and investors strengthen its position, ensuring seamless integration across the entire production and supply chain management process.

Collaborations, Clients and Geography

In navigating the complexities of the semiconductor landscape, OmniMeasure emphasizes collaborating with clients to understand and address their distinct needs. One notable partnership that stands as a testament to its transformative impact is a project supported by government ventures, where the company had to optimize process recipes using its advanced TSV measurement tools. During this project, several samples provided by the user were tested.

A notable outcome of the collaboration was the significant improvement in the client’s throughput and yield. By rectifying issues related to via shape and depth, OmniMeasure enabled the client to achieve optimal 3D wafer properties. Both round and square vias were tested through OmniMeasure’s solution.

The data obtained from these tests provided incontrovertible evidence of OmniMeasure’s efficacy in meeting the demands of semiconductor production. The results showed strong correlations with the client’s testing demands, confirming the accuracy and reliability of the company’s methods. This evidence illustrated OmniMeasure’s crucial role in driving manufacturing efficiency and product quality.

The strategic location in Hsinchu, Taiwan, further enhances OmniMeasure’s capabilities. “It is not easy to find a location like Taiwan, where we have such a fully integrated ecosystem spanning from IC foundries to production processes, encompassing order management and supplier networks,” says Chen. This unique environment enables companies like OmniMeasure to thrive by leveraging synergies across the semiconductor supply chain.

Looking ahead, OmniMeasure envisions seamless integration of advanced measurement tools into production processes, enhancing efficiency and reliability. The company’s trajectory includes significant advancements in glass substrates and panel-level packaging, catering to the burgeoning demands of high-performance computing and multi-function applications. As OmniMeasure innovates and evolves, it is poised to meet the escalating demands for smaller, faster, and more efficient IC designs.