Veeco Instruments Reduces Critical Shortages by 50% with LeanDNA

Semiconductor Review | Friday, January 17, 2025

 

Jackie Schwab, President,  Honest Components IncAlix Peterson, Customer Marketing Manager, LeanDNA

Veeco Instruments Inc. is a global capital equipment supplier that designs and builds processing systems for applications in semiconductor and compound semiconductor manufacturing, data storage, and scientific markets. These systems include advanced packaging, photonics, power electronics, and display technologies.

Stay ahead of the industry with exclusive feature stories on the top companies, expert insights and the latest news delivered straight to your inbox. Subscribe today.

 

Supply chain disruptions can impact production timelines, costs, and customer satisfaction in high-tech industries like semiconductor manufacturing. Managing the production of Veeco Instruments' complex systems, which take 13 weeks to build with a few launching each month, requires precise planning. As the Master Scheduler, Greg Martin oversees up to six systems simultaneously. With LeanDNA, he now has the critical visibility to forecast two months ahead, a capability he identifies as a key driver of their recent success.

The Challenge: Inefficient Manual Shortage Reporting

Inefficient reporting often leads to production delays, increased costs, or strained supplier relationships.

Before LeanDNA, Veeco Instruments faced challenges around manual shortage reporting processes that involved downloading data from SAP, reformatting it in Excel, and manually sharing it with management. This time-consuming process was prone to errors, leading to inefficient communication and long, drawn-out shortage meetings.

"We had to run reports, reformat them, and then use Excel to communicate shortages back to management. The shortage meetings would take over an hour, and communication wasn't effective because actions were outside of SAP," said Greg Martin, Master Scheduler at Veeco Instruments.

Additionally, the company’s existing ERP system, SAP, is limited in its ability to provide proactive insights into future shortages. The team could only focus on current issues without the ability to anticipate and prevent future delays.

The Solution

Veeco focused on enhancing visibility and streamlining the shortage management process by implementing LeanDNA as their intelligent supply chain execution platform. LeanDNA’s Clear to Build capability gives production planners visibility into orders that are ready to build, surfaces missing parts that prevent orders from starting production, and enables planners and buyers to collaborate better and prioritize orders to improve customer on-time delivery (COTD).

Additionally, LeanDNA’s Line of Balance reports help Veeco proactively manage shortage risks by identifying critical shortages, allowing the team to understand, prioritize, and collaborate effectively. By using both Clear to Build and Line of Balance reports, the Veeco team gained visibility into all expected production delays. This capability helped them focus on production delays during weekly meetings, enabling better task prioritization, clearer assignment of responsibilities, and more effective progress monitoring.

"LeanDNA allows me to focus on not just what's on shortages now but also looking ahead to see future shortages. I couldn't do that before. That's the big advantage. We are now able to identify not only current status but future needs. With LeanDNA, we see live feeds from our suppliers, so we are all in the know faster,” said Greg Martin, Master Scheduler at Veeco Instruments.

The Results

Reduced Critical Shortages by 50%

Since implementing LeanDNA, Veeco Instruments has seen remarkable improvements in its supply chain operations. The average number of critical shortages has decreased by 50% and is holding steady. Additionally, the team has significantly reduced the time spent in shortage meetings, freeing up time to focus on improving other areas of their supply chain operations.

"What used to take an hour in meetings, we now get done in half an hour, and we can use the full hour to cover more information," said Greg Martin, Master Scheduler at Veeco Instruments.

Team Time Savings and Faster QPO Resolutions

The improved efficiency has enabled the team to address other critical areas, such as reducing the time required to resolve quality purchase orders (QPOs) and return purchase orders.

Quality purchase orders are crucial in supply chain management because they ensure clear communication of product specifications and quality standards to suppliers, leading to consistent delivery of high-quality goods, minimizing returns, reducing production disruptions, and ultimately enhancing customer satisfaction by guaranteeing the final product meets expectations.

The time needed to resolve QPOs has decreased from 240 days to 120 days, a 50% improvement, with continued progress toward the company’s goal of 90 days. Freeing up more time for the buyers and giving them more visibility means they can focus on getting more QPOs resolved.

"You definitely need a tool to help your planning process. Just an ERP alone isn't enough. LeanDNA limits the need for custom reports and helps us react quicker, saving time and improving our overall efficiency," said Greg Martin, Master Scheduler at Veeco Instruments.

What’s Next

Looking ahead, Veeco Instruments is focused on further improving efficiency and agility to adapt to a growing business landscape. With LeanDNA as a critical tool in their supply chain strategy, they are well-positioned to achieve their goals of cost savings, increased quality, and faster demand satisfaction. Having already seen significant improvements, Veeco is now prepared for the anticipated increase in demand as it continues its journey to become even more agile and efficient.

LeanDNA has played a transformative role in Veeco Instruments’ supply chain optimization journey. By providing real-time visibility, improving communication, and enabling proactive management of shortages and production delays, LeanDNA has empowered the company to achieve significant operational improvements. For businesses hesitant to invest in intelligent supply chain solutions, the results speak for themselves.

 

 

 

More in News

The pursuit of absolute purity in semiconductor manufacturing presents significant challenges, as even a single microscopic particle can jeopardize the integrity of an entire production batch. As integrated circuits continue to shrink to the atomic level, the performance specifications governing the packaging and transportation of aggressive chemicals used in etching and cleaning processes have become increasingly stringent. Advanced fluororesins have emerged as fundamental components of this infrastructure, offering exceptional thermal stability and chemical inertness, attributes unmatched by any alternative materials. These application-specific polymers establish a protective barrier against contamination, thereby facilitating global fabrication facilities in their efforts to achieve higher yield objectives. When integrated into the production line, these high-performance materials provide manufacturers with a competitive advantage characterized by enhanced reliability and long-term structural integrity. How Does Chemical Inertness Drive Process Stability? The main advantage of fluororesins in semiconductor applications is their resistance to almost all corrosive materials used in wafer processing. Strong acids and organic solvents can corrode regular piping and storage systems, thus releasing metallic ions or particulates into the process stream. Under such conditions, fluororesins do not react, thereby preserving the ultra-high purity required for the processing of advanced logic and memory chips. This stability directly translates into reduced downtime for equipment maintenance and a corresponding reduction in the risk of unforeseen system breakdowns. Diversified Technologies, Inc. implements comparable high-purity and contamination-control measures in semiconductor systems to ensure consistent operational reliability. Due to their low surface energy, these materials reduce residue buildup and facilitate easier drainage, thus providing the shortest possible interruption for tools returning to production between flushes. As production facilities continue to improve their resource consumption, the long lifetimes of fluororesin parts open a straightforward approach to sustainable operational efficiency and lower total cost of ownership throughout the equipment lifecycle. DEMCO provides industrial-grade components and materials designed to maintain process integrity and minimize downtime in advanced semiconductor manufacturing. Why Is Thermal Resilience Crucial For Scaling? As the industry moves toward more complex three-dimensional architectures, the thermal loads on components being manufactured are increasing. Fluororesins would retain their mechanical properties over a wide temperature range, which is necessary in setups with very rapid thermal cycling or chemicals washed at high temperatures. Their thermal resilience ensures that seals, gaskets, and linings will not deform or lose their sealing properties in response to heat, thereby maintaining vacuum integrity in the processing chamber. It is precisely this ability to withstand changes without structural damage or outgassing that allows engineers to push the current limits of fabrication. In addressing material selection from a strategic viewpoint, business leaders must acknowledge that the physical limitations of the manufacturing environment are often equilibrated by the materials that constitute the containment of the process. The investment in advanced fluororesin solutions provides organizations' technical teams with opportunities to explore the cutting edge of microelectronics. This convergence of material science and industrial strategy will ensure that the infrastructure of the digital economy remains robust and poised to meet the next generation of consumer and enterprise demand for processing power. ...Read more
The proliferation of the Internet of Things (IoT) and advanced embedded systems is fundamentally reshaping the digital landscape. From smart cities and connected vehicles to industrial automation and intelligent medical devices, these innovations are driving an unprecedented demand for localized intelligence and real-time processing. At the heart of this revolution lie semiconductors, the unsung heroes powering the "edge" – where data is generated and acted upon, rather than solely relying on distant cloud infrastructure. The Semiconductor Imperative: Core Requirements for the Edge To meet the demanding requirements of next-generation IoT and embedded systems, semiconductors are evolving rapidly, with a strong focus on key performance attributes. Foremost is low power consumption, as many IoT devices operate on batteries in environments where frequent recharging or replacement is not feasible. This necessitates ultra-low-power architectures, efficient RF and physical layer designs, and optimized deep-sleep modes. Innovations such as voltage and frequency scaling (DVFS) and smart memory integration play a critical role in extending battery life. The shift toward processing complex AI and machine learning tasks at the edge has also increased the need for high-performance, energy-efficient computing. To this end, specialized processors—including AI accelerators and Neural Processing Units (NPUs)—are being integrated to enable real-time inference with minimal power usage. Miniaturization and functional integration are also vital, as IoT devices are often constrained by size and cost. Advances in semiconductor design now enable the consolidation of processing, memory, connectivity, and security functions into a single System-on-Chip (SoC), thereby improving efficiency across the board. Equally important is robust security. As IoT devices become more widespread, they are increasingly vulnerable to cyber threats. Semiconductor designs are therefore incorporating hardware-level security features such as secure boot, hardware root of trust, encryption for secure communication, secure key management, and tamper detection mechanisms. Innovations Driving the Future of Edge Semiconductors The semiconductor industry is experiencing a surge of innovation aimed at meeting the demands of next-generation computing. One significant development is the emergence of edge AI chips—dedicated processors designed to perform inference directly on devices. These chips are optimized for applications such as surveillance, industrial robotics, and smart home systems, with a focus on power efficiency, low latency, and compact form factors. Likewise, chiplet architectures are gaining prominence, replacing traditional monolithic designs with modular components that enhance scalability, enable efficient power management, and support heterogeneous integration within a single package. Advancements in process technologies are also driving progress, with leading-edge fabrication techniques like FinFET and Gate-All-Around (GAA) transistors improving energy efficiency by reducing power leakage and lowering operating voltages. Meanwhile, the adoption of the open-source RISC-V instruction set architecture is expanding across embedded systems. Its flexibility and cost-effectiveness enable greater customization, thereby accelerating innovation in chip design. Another transformative area is neuromorphic computing, which mimics the architecture of the human brain to deliver ultra-low-power, high-performance AI processing. This approach holds particular promise for real-time analytics and adaptive, self-learning embedded systems. The symbiotic relationship between semiconductors and edge computing will continue to drive innovation. As the IoT expands exponentially, the demand for more intelligent, secure, and energy-efficient edge devices will only grow. The future of embedded systems and IoT will be defined by semiconductor advancements that enable faster processing, robust security, longer battery life, and seamless connectivity, truly empowering the edge to become a strong, distributed intelligence network. ...Read more
Executives acquiring quartzware fabrication systems face a purchasing decision that reaches beyond component replacement. In semiconductor and adjacent manufacturing environments, quartzware sits close to process performance, equipment uptime and yield protection. A tank, carrier, tube, chamber or heat exchanger that appears minor on a procurement list can become a constraint when purity, tolerance control or lead time fails to match production needs. The right fabrication partner must therefore be assessed not only by what it can build, but by how consistently it can support continuity when demand shifts, equipment ages or legacy parts become difficult to source. Current pressure on manufacturing teams has made this decision more exacting. Many facilities are trying to extend asset life while maintaining process discipline, controlling cost and avoiding downtime. New builds remain necessary, but replacement alone is not always the rational answer. When a damaged quartz component can be restored to specification, repair capability becomes a strategic purchasing advantage. It helps teams preserve scarce capital, shorten recovery windows and reduce dependence on fresh fabrication when production schedules are exposed to raw material and capacity delays. Precision is still the baseline. Quartzware used in semiconductor equipment must be fabricated from appropriate high-purity material and held to tight dimensional requirements because contamination and variation can travel quickly into yield loss. Buyers should look for evidence that the supplier treats quality control as a release discipline rather than a final formality. That means documented inspection, tolerance verification, equipment upkeep and a workforce trained to repeat complex work without relying only on individual memory. A supplier’s ability to keep machinery calibrated, maintain fixtures and invest in the people doing the work often determines whether quality holds steady beyond one successful order. Flexibility is equally important. Many manufacturers inherit tools, assemblies and parts without current drawings, especially when equipment has been modified, transferred or supported by older OEM documentation. A capable quartzware fabrication system should be able to reverse engineer unfamiliar parts, translate samples into workable drawings and support both one-off and recurring needs. This is where the distinction between a parts vendor and a true fabrication resource becomes clear. The stronger partner can handle unusual geometries, repairs, production pieces and urgent requests while preserving inspection discipline and delivery reliability. Delivery performance should be treated as a technical requirement, not a customer service promise. In fabricationdependent manufacturing, lateness does not merely inconvenience purchasing. It can idle equipment, delay qualification or force teams into lower-quality substitutes. Strong suppliers build reliability through planned maintenance, trained labor, transparent quoting and realistic commitments. The best choice is the partner that can combine purity, repair judgment, engineering adaptability and delivery consistency into one dependable source. Desert Glass Works stands out for buyers needing this balance. Its relevant work spans quartzware repair, custom machining and precision fabrication for tanks, carriers, process chambers, diffusion tubes, bell jars, heat exchangers and related semiconductor components. The company’s model is well matched to buyers managing new requirements and legacy equipment, since it can repair or restore parts, reverse engineer components without drawings and fabricate custom quartzware from high-purity stock. Its emphasis on full inspection, maintained equipment, apprenticeship-based skill development and on-time delivery makes it a strong recommendation for organizations that need quartzware support tied directly to yield, uptime and disciplined execution. ...Read more
Longer validation cycles are forcing semiconductor factories to examine a cost that rarely appears cleanly on a procurement sheet: the time lost among test readiness, tool availability, engineering bandwidth and material movement. Advanced packaging, AI processors, automotive electronics and mixed-signal devices have widened the range of qualification work inside the same facility. A test cell may be technically capable, yet throughput still suffers when device programs shift faster than handlers and factory logistics can adjust. That pressure often shows up as idle equipment rather than an obvious planning failure. The buying question is no longer confined to tester performance. Executives responsible for semiconductor test and robotics systems need to understand how a platform behaves when product mix changes and validation data expands while factory movement becomes a constraint on output. Hardware flexibility matters because qualification programs cannot wait for major reconfiguration every time a device family changes. The test environment should support wafer sort, final test, system-level validation and diagnostic review while allowing engineering teams to move between device requirements with limited disruption.  Diagnostic visibility carries equal weight. AI accelerators and dense system-on-chip designs produce large volumes of validation data under demanding electrical conditions. Engineers need earlier anomaly detection, clearer failure analysis, yield-behavior context  and a practical way to connect test results to process variation. A system that only records pass-fail results leaves too much interpretation for later review. Better infrastructure helps teams identify variation while the qualification window is still open. Factory movement has become part of the same purchase logic. Semiconductor facilities often lose time in the handoff between test stages, especially when materials or qualified components depend on manual transport. Robotics should reduce that drag without forcing the factory into a redesign. Collaborative robots must be practical for inspection and machine tending, while autonomous mobile robots should coordinate transport across existing floor layouts, adjust to changing routes, respond to obstacles and reduce waiting time around qualification flow. Integration is where many automation programs lose momentum. Test equipment, robotics systems, factory software and data tools frequently come from different vendors, making communication gaps a real production issue. Buyers should press for open integration and clear status data. Deployment paths also matter, especially when custom work stretches past the point of early value. Reliability remains nonnegotiable, since a robot or tester that adds downtime during a qualification push creates the problem it was purchased to solve. Teradyne fits this buying logic because it brings semiconductor test equipment and intelligent robotics into one portfolio relevant to validation and factory flow. Its test systems support wafer sort, final test, system-level validation and broader device qualification for memory, analog, mixed-signal and system-onchip applications. Universal Robots gives it collaborative robots suited to machine tending and inspection work. Mobile Industrial Robots supports autonomous transport inside manufacturing environments. Teradyne’s emphasis on analytics, adaptable test platforms, collaborative automation and mobile robotics gives semiconductor executives a practical route to connect validation accuracy with steadier factory coordination. For buyers trying to reduce qualification delays without separating test decisions from movement constraints, it deserves close evaluation. ...Read more