Types of Advanced Packaging for Semiconductors

Types of Advanced Packaging for Semiconductors

A chip scale package is a kind of integrated circuit package. To qualify as chip scale, the package should have an area greater than 1.2 times that of the die as well as it should be a single-die, direct surface mountable package.

Fremont, CA: Semiconductor packaging plays a pivotal role in protecting chips from the surrounding, thus ensuring electrical connection for chip mount on printed wiring boards. Semiconductor packaging and assembly embrace many technologies such as material, electromagnetic characteristics, surface treatment, three-dimensional (3D) chip stacking, thermal dissipation, part integration, and circuit implementation design.

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Semiconductor packaging has a vital role in manufacturing because it is among the nearest steps to end customers. Futhermore, the complexity of production conditions makes controlling a semiconductor packaging facility a difficult task, and dynamic factory simulation has been considered as an effective way to complete this task.

Packaging is a backend operation in semiconductor manufacturing. Comparing with the frontend operations, the backend operations need substantially less expenditure and time. Additionally, the backend operations are closer to the end customers than the frontend operations, and marketing time is more crucial for the backend operations.

Chip-Scale Package

A chip scale package is a kind of integrated circuit package. To qualify as chip scale, the package should have an area greater than 1.2 times that of the die as well as it should be a single-die, direct surface mountable package. The die may be situated on an interposer upon which balls or pads are formed like flip-chip ball grid array packaging. The pads might be printed or etched directly onto the silicon wafer, leading to a package very close to the size of the silicon die. Such a package is known as a wafer-level package (WLP) or a wafer-level chip-scale package.

See also: Top Semiconductor Technology Solution Companies

Wafer-Level Packaging (WLP) Technology

The manufacturing processes focus on the requirements that the users must meet to make sure the reliability of the end product. Integrated circuits are built to provide all the electrical functions required and to fit into a specific set of packages. The bond pads on the chip are connected to a conventional package’s pins through wire bonding. Design rules for conventional packages need the bond pads to be located at the perimeter of a chip.