In semiconductor manufacturing, laser technologies are used for dicing, drilling, patterning, debonding, annealing, inspection, and metrology, to name a few. Thus, contributing to the global semiconductor market's development.
Fremont, CA: Both modern-era digital devices and future technologies, depending on the semiconductor industry. In terms of revenue generation, it has increased by a factor of ten in the last decade, and it is expected to continue this trend well into the next.
Artificial intelligence (AI), the Internet of Things (IoT), quantum computing, and 5G, among other emerging technology segments, have had a significant effect on the semiconductor industry's dynamics, along with the connected world's increasing demands for higher processing speed and performance, low-power devices, and intelligent chipsets.
Here are three key trends emerging in the semiconductor sector:
Over the last few years, laser developments have seen a steady increase in their use in semiconductor manufacturing. In semiconductor manufacturing, laser technologies are used for dicing, drilling, patterning, debonding, annealing, inspection, and metrology, to name a few. The need for die size reduction, higher yield, better quality, and precision are all driving laser's contribution to the global semiconductor market's development. This smooth transfer of a pre-existing technology from one industry to another has improved the process, and further advancements in the field will accelerate this trend.
One of the most critical factors in the evolution of semiconductors is semiconductor lithography. The latest advances in photonics, biochips, and front-end memory applications have resurrected Nano-Imprint Lithography (NIL) as the new frontier in this area.
NIL is laying the groundwork for cutting-edge lithography procedures in a simpler format by being able to manufacture semiconductors with higher resolution and uniformity than those provided by photolithography equipment.
Advanced Packaging Solutions
Manufacturers and buyers will eventually customize their products at a lower price thanks to advanced packaging. Fan-out wafer-level packaging, multi-row QFNs (quad-flats no-lead), interconnection technologies, through-silicon vias (TSV), 2.5D and 3D integration, stacked containers, and system-in-package are some of the advanced packaging technologies. Smaller packaging solutions would also drive system size reduction innovation, allowing for increased processing capacity while consuming less energy.