Key Global Semiconductor Industry Trends to have an Eye on!

Key Global Semiconductor Industry Trends to have an Eye on!

The semiconductor industry is the keystone of modern digital devices and future technologies. It has rapidly grown over the past decade in revenue generation and is anticipated to continue evolving.

FREMONT, CA: The dynamics of the semiconductor industry has been influenced in significant ways because of the increasing demand for artificial intelligence (AI), Internet of Things (IoT), quantum computing, and 5G, and the need for higher computational speed and efficiency, low-power devices and intelligent chipsets.

Here are three key semiconductor industry trends:

Utilizing Laser Technologies for Better Precision

Semiconductor manufacturing has been slowly adopting laser technologies for different uses. This technology is used in semiconductor and PCB processing applications for optimized and streamlined production of the semiconductor.

One of the benefits of laser technology in the global semiconductor market is the reduction of die size, precision, improved quality, and higher yield. Other application areas of this technology in semiconductor manufacturing are debonding, inspection, dicing, annealing, metrology, and patterning.

Exploration of Alternatives to Silicon

Today, R&D activities in the global semiconductor industry aim to find alternative materials for semiconductor manufacturing as the extent for shrinking silicon-based substrates has become insignificant. For new and emerging semiconductor substrates, the market is anticipated to exceed over USD 400 million by 2024, increasing at a rate of 24 percent between 2018 and 2024.

Emerging substrates like Gallium Nitride (GaN) and Silicon Carbide (SiC) have shown exceptional wide-bandgap (WBG) qualities, which can be an alternative for traditionally-used silicon. This selection of appropriate substrates will allow the assessment of WBG, a crucial semiconductor factor that helps in higher switching speeds in transistors.

Boosting Semiconductor Integration with Advanced Packaging Solutions

Implementing new chip technologies and its packaging methodology across various applications have become a vital growth opportunity. Advanced packaging will provide possibilities of customization for manufacturers and buyers are reduced cost.

Fan-out wafer-level packaging, interconnection technologies, multi-row QFNs, system-in-package, stacked packages, through-silicon vias, 2.5D, and 3D integration are some of the advanced packaging technologies.