Intel Achieves Significant Progress in the Study of Quantum Chips

Intel's achievement represents a significant milestone for scaling and working toward fabricating quantum chips on transistor manufacturing processes.

The Intel Labs and Components Research divisions have proven the industry's greatest reported yield and uniformity of silicon spin qubit devices built at Intel's transistor research and development centre, Gordon Moore Park in Ronler Acres in Hillsboro, Oregon.

This accomplishment is a key step in the scalability and development of the transistor manufacturing procedures used by Intel to fabricate quantum devices. The second-generation silicon spin test chip from Intel was used in the study.

The scientists extracted 12 quantum dots and four sensors while testing the gadgets using the Intel cryoprobe, a quantum dot testing equipment that runs at cryogenic temperatures (1.7 Kelvin or -271.45 degrees Celsius). With a single electron at each place over the 300-millimetre silicon wafer, this result is the industry's largest silicon electron spin device.

Currently, available silicon spin qubits are normally displayed on a single device, but Intel's research shows success across the course of a whole wafer. The chips, which were created using EUV lithography, exhibit amazing uniformity with a 95 per cent yield rate throughout the wafer. More than 900 single quantum dots and more than 400 double quantum dots at the final electron were described at one degree above absolute zero in less than 24 hours to the cryoprobe and reliable software automation.

Compared to earlier Intel test chips, devices defined at low temperatures have a higher yield and more consistency, which enables Intel to employ statistical process control to pinpoint parts of the fabrication process that could be improved. This quickens learning and is an important step in scaling up to the hundreds, or perhaps millions, of qubits needed for a practical quantum computer.

The greatest demonstration of single and double quantum dots to date was made possible by Intel's ability to automate data collecting across the wafer at the single electron regime to the cross-wafer yield.

This improved yield and uniformity in devices defined at low temperatures over prior Intel test chips is a significant step toward scaling to the hundreds or millions of qubits needed for a commercial quantum computer. According to James Clarke, Intel's Director of Quantum Hardware, the company is still making progress in producing silicon spin qubits using its transistor manufacturing techniques.

The achievement of high yield and homogeneity demonstrates that building quantum devices using Intel's proven transistor process nodes is the appropriate strategy and is a strong indicator of success as the technologies mature for commercialisation. They will continue to develop larger-scale systems and enhance the quality of these gadgets in the future, using these initiatives as stepping stones to go forward swiftly. Clarke goes on to describe Intel's advances in quantum computing.

Quantum computing uses the superposition and entanglement aspects of quantum physics to carry out the computation. Data represented electrically as on or off states is encoded in binary using conventional transistors.