Inpria Bags $31M to Drive EUV Photoresist Platform

Inpria Bags $31M to Drive EUV Photoresist Platform

Inpria has raised $31 million to enable a breakthrough EUV photoresist platform.

FREMONT, CA: A leader in high-resolution metal oxide photoresists for extreme-ultraviolet lithography, Inpria, has secured $31 million in Series C funding from a wide syndicate representing pioneers from across the semiconductor manufacturing ecosystem. This series of financing was led by a photoresist manufacturer and existing investor, JSR Corporation, along with SK hynix Inc. and TSMC Partners. Existing investors Air Liquide Venture Capital ALIAD, Applied Ventures, Intel Capital, and Samsung Venture Investment Corporation were also included in the funding. Inpria is the world pioneer in metal oxide photoresists for advanced EUV lithography process.

Inpria photoresists deliver higher resolution with building blocks a fraction of the size of traditional polymer-based resists, comprised of tin-oxide nanoclusters, and are tuned to absorb EUV photons optimally. Inpria photoresists enable simpler manufacturing flows, and larger process windows for an overall reduction in the cost of ownership with unparalleled etch selectivity. The company brought online its high-volume manufacturing plant for supporting the initial production ramp for customers. The investor participation serves as an indicator for Inpria's strategic significance to the semiconductor industry. Inpria is thrilled that most of its investors include all semiconductor manufacturers worldwide that are currently adopting EUV patterning.

Inpria Corporation is a pioneer in increasing semiconductor lithography with inorganic photoresists for nanoscale patterning. Inpria Corporation's patented photo-condensed molecular oxides provide customers with the unique ability to deposit – straight from the solution that is atomically smooth, intrinsically dense, and directly photo patternable metal oxide films, facilitating advanced performance with simplified processing.