The ClassOne Solstice S8 is an 8-chamber system for high-performance, entirely-automated electroplating as well as surface preparation.
FREMONT, CA: Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice S8 electroplating system to a major semiconductor foundry service based in Taiwan. This is the second S8 to be bought by the company. The 8-chambered Solstice platform is designed particularly for ≤200mm wafer processing. The new tool will be utilized to produce Heterojunction Bipolar Transistors (HBTs) and Vertical Cavity Surface Emitting Lasers (VCSELs). The declaration was made by ClassOne's CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.
"This user is a high-volume semiconductor manufacturer," stated Ghekiere. "So they are interested not only in the Solstice's superior plating performance, but also in its reliable, fully-automated high throughput. The tool is being used for wafer level packaging processes, including copper pillar and solder bump electroplating."
"This customer has been using our Solstice S8 electroplating equipment for several years now," stated Exarcos. "The tool has been fully qualified for their processes and is meeting their aggressive performance goals. Now, their business is rapidly expanding, and they've chosen to bring in a second S8 to support that growth. We're actually seeing this pattern across the industry today. As Solstice is becoming embedded into customer processes, the repeat orders are coming in with increased frequency. We're very gratified by this vote of confidence in the Solstice and in ClassOne."
Ghekiere noted that today's HBT devices are utilized in many ultrafast circuits and those requiring high power efficiency, including 5G cellular phones, next-generation RF power amplifiers, and more. VCSELs are utilized in 2D and 3D imaging, smart-glasses, facial recognition, LiDAR, fiber optic communications, and much more.
The ClassOne Solstice S8 is an 8-chamber system for high-performance, entirely-automated electroplating as well as surface preparation. The Solstice series, which was specifically designed for ≤200mm wafer processing, also includes the S4, which offers up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool's special Plating-Plus™ capabilities empower it to handle a number of other surface preparation functions, including wafer cleaning, resist strip, high-pressure metal lift-off, UBM etch and more. This multi-processing flexibility serves to streamline process production and can decrease the number of different tools a user needs to purchase.