The manufacturing processes rely on the requirements that the users must meet to make sure the reliability of the end product. Integrated circuits are designed to offer all the electrical functions required and to fit into a specific set of packages.
Fremont, CA: What does packaging mean? It literally means wrapping or protecting goods. However, in the field of media it usually refers to the flow and sequencing of commercial production or news from beginning to end. Packaging in electronics refers to a different term, which includes the design and production of enclosures for electronic devices varying from individual semiconductor devices up to complete systems. Electronic packaging is a key discipline within the field so as to develop durable as well as long-lasting functionaries.
Almost all systems and appliances in various spheres, including home appliances, industrial, medical, information, and transportation systems contain semiconductor chips. The Semiconductor packaging process is popular amongst the emerging sectors.
This global market has been growing at a higher pace with the progress of imaginative frameworks as well as a developing end-client tendency. Semiconductor packaging materials are a type of electronic solution utilized to form the connection of the IC chip to the package substrate.
A chip scale package is a kind of integrated circuit package. So order to qualify as chip scale, the package should have an area greater than 1.2 times that of the die and it should be a single-die, direct surface mountable package. The die may be placed on an interposer upon which balls or pads are formed such as flip-chip ball grid array packaging. The pads may be printed or etched directly onto the silicon wafer, leading to a package very close to the size of the silicon die. Such a package is known as a wafer-level package (WLP) or a wafer-level chip-scale package.
Wafer-Level Packaging (WLP) Technology
The manufacturing processes rely on the requirements that the users must meet to ensure the end product's reliability. Integrated circuits are designed to offer all the electrical functions required and to fit into a particular set of packages. The bond pads on the chip are connected to the pins of a standard package through wire bonding. Design rules for standard packages require the bond pads to be situated at the perimeter of a chip. In order to avoid two designs for the same chip, a redistribution layer is generally needed to connect bumps to bond pads.