Analog Devices

Soomneck Echeng is a distinguished leader in the global semiconductor industry. As the director of Wafer Sort and Trim at Analog Devices Inc., Penang, Malaysia, he leads multifaceted teams across engineering, maintenance, operations and automation. His leadership has been key in driving operational excellence and advancing innovations in test automation and wafer sort technologies. Echeng has earned a reputation as a forward-thinking engineer, strategic mentor and transformation leader, consistently shaping the future of semiconductor manufacturing.

Echeng's journey into electronics and automation began with academic pursuits in Malaysia. He completed his higher national diploma in electrical, electronics and communications engineering from Universiti Teknologi Malaysia in 1994.

After completing his diploma, he started his career at Intel Corporation, where he spent over 11 years as a test equipment and process engineer. At Intel, he played a major role in the startup and qualification of new hardware and processes required for introducing new microprocessors. He also supported product transfer and the qualification of new technologies for high-volume manufacturing. These early experiences gave him a deep understanding of technical processes and global operational frameworks.

While working at Intel, Echeng pursued higher studies and earned a bachelor’s degree in electrical and electronics engineering from the University of Lincoln in 2004.

Echeng joined Infineon Technologies in 2005 and served the company for 17 years, marking a defining chapter in his professional journey. As director of wafer test equipment engineering, automation and maintenance, he led cross-functional teams responsible for equipment sustainability, test automation and process optimization. His work was essential in implementing industry 4.0 practices, including system integration, real-time data analytics and automation advancements. Echeng emphasized benchmarking overall equipment effectiveness, driving cost efficiencies and promoting a zero-defect mindset, while maintaining the highest product quality standards.

Echeng's leadership was instrumental in modernizing wafer test operations through smart automation initiatives that reduced manual interventions and increased operational agility. His knowledge of various equipment, including probers, handlers and laser systems, helped streamline complex backend environments.

In 2022, Echeng joined AT&S Malaysia as an engineering backend senior manager, where he led strategic process improvements and mentored high-performing engineering teams. His leadership focused on enhancing backend operations, optimizing equipment utilization and implementing solutions that improved overall productivity.

Since April 2023, Echeng has been with Analog Devices, Inc., where he now directs the wafer sort and trim division. In this role, he combines decades of engineering insight and leadership experience to drive innovation across equipment, process and automation. His focus remains on generating high-performing teams and pushing the frontier of test automation within its manufacturing operations.

Echeng has developed deep expertise in semiconductor process engineering, test systems, automation and manufacturing operations throughout his career. He strongly emphasizes mentoring engineers and fostering a culture of accountability and excellence.

With an eye on emerging technologies, Echeng drives impactful change within the semiconductor industry, fostering innovation that enhances manufacturing efficiency and redefines industry standards. He continues to serve as a guiding force, shaping the future of semiconductor manufacturing.