IntekPlus
New Semiconductor Packaging Inspection Techniques, Unveiled

Quality remains a paramount driver as it gains an even greater significance in today’s market, where customers seek comprehensive information about a product. The consumers’ emphasis on quality is particularly evident in the semiconductor industry, where companies extensively conduct numerous tests before finalising the packaging and launching a product into the market.

INTEKPLUS has diverse business divisions, including semiconductor and secondary battery inspection in the EV sector, with a clear focus on quality. It specialises in providing final package inspection services in the semiconductor division. This involves inspecting chips or integrated circuits (ICs) after completing the front-end, back-end, and assembly processes, ensuring their quality before shipping to customers.

“Our knowledge and drive for packaging excellence has led to major chip manufacturers selecting us as their sole solution provider for IC package inspection,” says Shahab Chitchian, CMO at INTEKPLUS.

By proprietary integration of machine vision and AI deep learning, the company’s semiconductor package business unit caters to all the inspection needs of chip manufacturers, memory makers, and OSATs. INTEKPLUS’ solution enables high-speed handling, including in-tray inspection with robust 2D/3D stitching function and vibration-free single-inspection picker modules. The inbuilt large FOV vision module encapsulating two-colour coaxial illumination and a high-resolution camera portrays a clearer picture of a chip during the inspection.

Top-side 3D vision also helps real total and mold height inspections and to check for any issues in a chip’s underfill, passive components, and top-side warpage. Using direct cameras, the side inspection feature enables multi-illumination side inspection, including the EMI shield and mold thickness check.

INTEKPLUS’ technology allows chip producers and OSATs to auto-calibrate their products inspection machines, minimize inspection deviation, and simplify jobsetting management, which result in effective factory operation. Users can access a customized report and make informed decisions using an inbuilt review system, ensuring products’ quality is not compromised. The company is a leading solution provider to well-known memory enterprises, as it delivers full auto memory module, SSD, and RAM inspection systems.

By using a proprietary white-light scanning interferometry (WSI) technique, INTEKPLUS also provides mid-end 3D interconnect inspection for high-performance computing (HPC) and AI chips employed on top Foundry and IDM heterogeneous chip packaging.

Clients receive a significant increase in interconnect quality, covering parameters like bump height, coplanarity, and chip warpage, which result in improving product yield and reducing total product cost. INTEKPLUS’ systems provide accurate sorting and inspection results as they seamlessly interface with client factory systems, offering data to improve decision-making and facilitate efficient production lines.

The company’s WSI uses a coaxial illumination source and camera, custom-made frame grabber, and GPU processing to create shadow-free images that accurately measure the interconnect or bump height. INTEKPLUS’ WSI has the key advantage of distinguishing transparent layers during redistributed layers (RDLs) processing for fan-out wafer-level packaging (WLP) applications.

INTEKPLUS also has a separate business unit for EV batteries, displays, and car bodies inspection. INTEKPLUS’ high-tech secondary battery production inspection includes a notching integrated inspection module, lamination VCT inspection module, and cell inspection equipment. It caters and intends to target the 100-plus battery and EV production projects that have been announced or are under construction in the US, owing to the recently passed USA New Green Energy IRA and representing around USD 200 billion in total investments.

In terms of testing displays, the company uses an intricate knowledge of inspection techniques to implement cell and module inspection at major display makers in Korea and China. Its machine vision camera is applied to OLED production line for foldable display modules. For car body inspection, it has received a contract from a major automotive company and the system is being developed and tested at a manufacturing facility in Korea.

INTEKPLUS’ cutting-edge technologies, such as its WSI, dual-type slit beam scanning, direct four-side, in-tray inspection, and AI deep learning integration have positioned it as a preferred partner for semiconductor manufacturers. Its success stories with top IDMs, Foundries, OSATs, and other top customers are a testament to its inspection technologies effectiveness and innovation..