Inari Amertron Berhad: Spearheading Growth in OSAT arena

Inari Amertron Berhad comes forward with its best-in-class services and solutions in outsourcing semiconductor assembly and test (OSAT). Based in Malaysia, Inari Amertron Berhad is an investment holding company with whollyowned subsidiaries in the OSAT industries. The company provides DC and RF wafer probing, back-grinding, wafer sawing, wire bonding/flip chip, molding, advanced system-in-packaging (SiP), and other related services.
“We offer an entire raft of services in OSAT manufacturing technology, from wafer processing, assembly, and testing, and System-On-Module (SOM) before shipping to the end-customer warehouse,” says Lau Kean Cheong (KC Lau), CEO and Executive Director of Inari Amertron Berhad.

With the accelerated development of AI, soaring demand for electric vehicles, and the aggressive migration from 4G to 5G, the semiconductor industry is experiencing an unprecedented boom. The World Semiconductor Trade Statistics (WSTS) 2022 market forecast shows the worldwide semiconductor market growing by 10.4%, which translates to an additional $613.5 billion in sales.
Companies are keen to acquire SOM solutions that can tackle and ease the chip shortage problem faced by electronics manufacturing services (EMS).

With high-mix low-volume and low-mix high-volume operations, the company offers products for various sectors like the smart mobile devices, the automotive and the optical communication sectors. The company manufactures over 5 billion chips annually and manifests considerable expertise in assembly technology and risk management.

Over the last three decades, the company has actively developed three business models. The Captive model follows the “COPY-EXACT” methodology. Using this high-volume operation model, customers can control IPs and platform designs. The Captive + Customized Model, allows the customer to choose Inari Amertron Berhad’s existing solutions and combine them with their own technology. Finally, an integrated turnkey solution provides an open tool platform that can meet customer requirements cost-effectively. This model combines the processes and materials into Inari Manufacturing Execution System (IMES) and provides end-to-end customized tools, platforms, integrated manufacturing systems and more importantly Predictive Quality Control.
Inari Amertron Berhad combines three business models, technology applications, and resources to deliver costeffective solutions. It is characterized by its speed in highvolume manufacturing, ensuring real-time monitoring and control for better quality and yielding substantial returns to customers. The company works closely with clients to customize, reengineer, and automate manufacturing processes. Inari Amertron Berhad’s products, such as RF module, Fiber Optics, Hermetic IC, and Optoelectronics, have various uses in multiple industries.
  • We offer an entire raft of services in OSAT manufacturing technology from wafer processing, assembly, and testing, and SOM before shipping to the end-customer warehouse

While catering to the needs of diverse industries, Inari continues to focus its investments and ESG effort on developing green technologies and improving plant operations management systems to reduce its environmental footprint. In the same vein, the company is exploring the possibilities offered by solar power and is installing the technology at plants to lower carbon output and reduce operating costs.

As Malaysia's largest listed technology company, Inari Amertron Berhad has been building exceptional local ecosystems that can support fast-turnaround solutions. It aims to develop more packaging platforms for newer applications and work on diverse market segments through its robust operation track record.
Share this Article:
Inari Amertron Berhad

Inari Amertron Berhad


Lau Kean Cheong (KC Lau), CEO/Executive Director of Inari Amertron Berhad

Inari Amertron Berhad is an investment holding company with wholly-owned subsidiaries involved in the OSAT services. The company is performing and provides DC and RF wafer testing, wafer back-grinding, wafer sawing, wire bonding, substrate molding, substrate sawing, chip sip assembly, and other related services.