Hana Micron
Redefining Innovation in the Semiconductor Back-End

Dong Cheol Lee, CEO

How does Hana Micron convert fragmented customer expectations into scalable, high-precision back-end execution?

Central to this success lies its “differentiated customized services”, a philosophy that goes beyond transactional projects. Hana Micron’s loyalty among global chipmakers stems from its co-engineered solutions model, built on trust, technological investment, and long-term collaboration. This model, integrated with the company’s commitment to quality and technical excellence, has transformed client relationships into enduring strategic partnerships. Clear project decision frameworks, regular technical exchange meetings, and transparent performance reviews govern these partnerships.

Building Loyalty through Customized Partnerships

What specific behaviors build long-term loyalty among memory customers during uncertain project cycles?

In the memory segment, Hana Micron has cultivated enduring customer loyalty through reliable execution and shared success. The company supports customers in navigating uncertain new projects by committing early investments in tools, talent, and infrastructure, often ahead of competitors. This proactive stance has strengthened confidence among its long-standing memory clients, who trust Hana Micron not just to deliver, but to innovate alongside them.

“Our edge comes from our willingness to make fast, proactive investments and our deep understanding of customers’ technical challenges. We don’t just supply, we solve and co-develop,” states Jung Eun, general manager.

Its engagement in non-memory sectors reflects a similar but more complex strategy. Here, Hana Micron’s approach merges technical consultation with agile development support. Engineers collaborate directly with customers across package design, simulation, and process optimization to achieve the best balance of structural integrity, quality, and performance.

This collaborative engineering ensures that even challenging requirements—from advanced system-in-package (SiP) modules to niche custom form factors—reach the factory floor with minimal friction. Customers are willing to adopt these next-generation packages early because the same teams that co-design and qualify new process technologies remain accountable through ramp-up and volume production, reducing the risk of unexpected failure modes in the field.

The recent stabilization of the company’s Vietnam operations has also allowed Hana Micron to offer cost-competitive manufacturing without compromising its hallmark quality standards. This alignment of technology, scale, and localized efficiency has enabled the company to become a partner of choice for customers seeking both performance and value in back-end processing.

Which foundational capabilities allow Hana Micron to remain competitive across rapidly shifting semiconductor segments?

While customization drives loyalty, Hana Micron’s sustained competitiveness rests on a set of strengths that transcend market or product type. Commitment to on-time delivery, rigorous quality control, deep technical expertise, and a nuanced understanding of each customer’s operational reality remain constant, regardless of application segment. These core competencies, developed over decades of customer-facing execution, manifest in the company’s continuous alignment with evolving semiconductor nodes and emerging packaging standards.

Agility within this structure comes from specialization. The company’s R&D framework is segmented across three focused divisions: a Process Development Group specializing in new and complex technologies, a Material Development Group driving innovations in design and materials, and a Technology Group focused on adapting and stabilizing legacy technologies for ongoing production. This targeted specialization keeps innovation pipelines agile while ensuring that existing lines retain predictable reliability and yield.

Leading the Next Wave of Advanced Packaging

In what ways is Hana Micron addressing packaging demands driven by chiplet architectures and HPC?

Hana Micron’s technological ambition crystallizes in its response to industry shifts, including 2.5D/3D architectures, chiplet-based integration, and heightened thermal demands from high-performance applications. The company’s Heterogeneously Integrated Chip (HIC) technology—its proprietary entry into advanced 2.xD packaging—embodies this adaptive spirit.

HIC enables vertical and lateral die-to-die interconnects using bridge dies, allowing ultra-dense system integration suitable for HPC and chiplet-based SiP architectures. The implications extend beyond form-factor miniaturization; HIC lays the groundwork for energy-efficient, thermally stable performance in next-generation computing systems. The innovation earned Hana Micron a place among the Top 20 Papers at the 2025 Electronic Components and Technology Conference (ECTC), a distinction shared with global titans like Intel, NVIDIA, IBM, and Sony.

“Beyond individual package technologies, our strength lies in integrating flip-chip, large-body substrates, and advanced 2.5D concepts into manufacturable, high-yield solutions tailored to each customer’s system requirements,” says Eun.

Underpinning these breakthroughs is a continuous cycle of strategic collaboration and innovation. Hana Micron invests jointly with foundries, equipment makers, and specialized suppliers to test and validate emerging processes and materials. Focused initiatives on ultra-thin wafer handling, particle and defect control, and proprietary reliability algorithms are setting new benchmarks in product robustness and process precision. Each advancement, while rooted in technical complexity, directly translates into customer advantage: higher yield, longer lifecycle, and better overall performance predictability.

Integration, Agility, and a Sustainable Vision

What differentiates Hana Micron further is the operational integration of its entire back-end process chain. From wafer test to assembly, packaging, final testing, and module completion, all steps are managed under one roof. Its full-spectrum capability eliminates cross-site movement, minimizes handling risks, and enhances real-time communication between process teams, all of which improve throughput and reliability. For customers, this integrated structure reduces execution risk by tightly coupling engineering changes with production, shortening feedback loops and lowering the chance that late-stage surprises will impact delivery or quality.

Customers benefit from accelerated turnaround and consistent quality across diverse packaging portfolios, including QFN, FBGA, FCCSP, FCBGA, WLCSP, and SiP modules. Operational excellence, however, extends beyond efficiency metrics. Hana Micron’s recent focus has been on embedding environmental accountability into its back-end operations. Through combined efforts in yield optimization and waste reduction, the company achieves both cost and ecological gains without compromising delivery commitments.
Its ongoing upgrades in HVAC systems, dust-free environments, and equipment calibration also contribute to reductions in defect rates and energy use. The company’s capability to mass-produce thinner dies—down to 30 µm chip thickness and 5 µm die-attach film—demonstrates how technical precision and sustainability intersect. Similarly, its in-house development of high-thermal-conductivity materials, including indium- and graphene-based thermal interface materials (TIMs), explains how innovation can address both environmental and performance challenges in advanced device integration.

These successes reflect a deeper cultural trait, responsiveness. Hana Micron credits its consistent growth over the past five years to a mindset of continuous readiness, encompassing technical, operational, and relational aspects. Every investment and collaboration that the company undertakes emphasizes its ability to meet evolving market expectations while maintaining the trust of the world’s most demanding semiconductor customers.

As the industry edges toward even smaller geometries, denser packaging, and greater power efficiency, Hana Micron’s integrated R&D model and “from partnership to performance” philosophy seem increasingly vital. Through its commitment to customer collaboration, technical depth, and execution reliability, Hana Micron continues to strengthen its role as a trusted back-end process solution provider for leading semiconductor companies worldwide.