Goldlink
A Global Leader in Micro Precision Parts

Semiconductors power the modern world. From handheld devices to AI-driven systems, microchips form the basis for technological progress. However, before these chips can be integrated into products, they must undergo rigorous testing to ensure flawless performance. Even the smallest defect can lead to device failures, costly recalls, and reduced efficiency, making semiconductor testing an indispensable step in chip manufacturing that requires absolute precision.

While chip manufacturers focus on production, companies like Goldlink play a crucial yet often overlooked role in ensuring quality. The company specializes in manufacturing ultraprecise micro parts, serving industries such as semiconductor testing, medical equipment, communications, and new energy. With advanced technology, superior quality, and shorter time to delivery, Goldlink meets the growing demand for high-precision micro parts.

Goldlink is a leader in testing probe parts—the ultra-fine pins that establish reliable electrical connections between chips and testing equipment. These probes are essential for the world’s top chipmakers, ensuring that their products meet rigorous performance standards before reaching the market. By combining deep expertise in material science and precision engineering, Goldlink produces probe parts that are exceptionally durable and highly conductive, enabling accurate and efficient signal transmission during testing.

Advancing Precious Metal Materials for High- Performance Testing

Providing high performance semiconductor test probe parts is the driving force behind Goldlink’s research into precious metal materials. Unlike competitors that depend on external suppliers, the company develops specialized alloys in-house, enhancing conductivity, durability, and signal integrity. Goldlink’s palladium alloy bars and phosphor bronze tubes are available in customized OD, ID and length with more precise dimensional tolerances, good electrical conductivity and machinability.

“Our research in precious metal materials enables us to develop new alloy materials that significantly improve conductivity, durability, and reliability in semiconductor testing,” says Mr. Cao Lei, CEO of Goldlink.

Goldlink is investing in next-generation materials, including high-purity tungsten and advanced composite alloys, to further improve probe resilience and performance.

By integrating material science with precision manufacturing, Goldlink ensures that semiconductor manufacturers have access to test solutions that meet the highest industry standards.

High Manufacturing Capabilities and Global Reach

By February 2025, Goldlink has a 32,500 square meters R&D and manufacturing facility, with over 320 CNC machines supporting advanced post-processing technologies. With a monthly output of 25 million high-precision parts, it guarantees a steady, high-quality supply to semiconductor manufacturers worldwide.

Goldlink’s expertise covers a wide range of semiconductor testing probe parts, including top plungers, bottom plungers, barrels, springs, and insulators. The company also specializes in heat treatment and plating technologies to improve part durability and conductivity, ensuring that testing probes withstand repeated use while maintaining optimal electrical performance.

By overseeing the entire production process—from material development to final machining—Goldlink ensures superior quality, cost efficiency, and reliability. This integrated approach sets Goldlink apart in the industry, enabling direct oversight of raw materials and processing to drive continuous innovation.

In addition to Mainland China, the company has wholly owned subsidiaries in Japan and Hong Kong, serving customers across the U.S., Germany, Japan, Singapore, Malaysia, etc.

Driving Innovation in Semiconductor Testing

Goldlink’s strength lies in its commitment to precision engineering. The company manufactures parts with minimum diameter of 0.02mm, minimum tolerance of ±0.002mm, and mirror finishing on probe heads which is as small as 0.05mm in diameter. This level of accuracy ensures that semiconductor testing meets the highest industry standards, minimizing errors and increasing efficiency.

Reinforcing its dedication to excellence, Goldlink holds 43 patents and maintains internationally recognized ISO9001 and ISO14001 certifications. These achievements reflect the company’s strict quality control, environmental responsibility, and customer-centric approach.

Beyond product excellence, Goldlink prioritizes long-term partnerships and customer satisfaction. The company works closely with semiconductor manufacturers to develop customized solutions, to meet the challenges of ever-changing chip testing in an efficient and precise manner. A notable success story involved a leading semiconductor testing socket supplier that required high-volume precision probe parts for Intel and NVIDIA chip testing.

As semiconductor technology advances at an unprecedented pace, Goldlink remains committed to advancing micro-precision manufacturing. The company continues to expand its expertise in semiconductor chip testing probe components, advanced precious metal materials, and high-precision machining and plating technologies.

The company will continue to expand its machining capabilities in micro parts such as semiconductor chip test probe parts, as well as the development and production of related precious metal materials.

By innovation in these areas, Goldlink stays ahead of industry demands, delivering cutting-edge testing solutions. As a leader in micro-precision part manufacturing, Goldlink welcomes new collaborations with semiconductor manufacturers seeking the highest levels of precision, efficiency, and reliability in chip test.