EV Group
Serving Next-Gen Applications Of Micro-Fabrication Technologies

Constant innovation has always propelled manufacturing organizations to new heights as they pave the way to develop new devices. Having developed the world’s first double-sided mask aligner with bottom-side microscopes, which enabled the widespread commercialization of MEMS products in 1985, the EV group is a pioneer in innovation.Founded in 1980, the firm is a market leader in providing equipment and process solutions for the fabrication of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. With over 1100 people employed globally, the firm provides services and support to a global network of clients and partners through fully-owned subsidiaries in the United States, Japan, South Korea, China, and Taiwan.

EVG revolutionized wafer bonding technology in 1990 by developing the process separation between wafer alignment and wafer bonding, which has since become an industry standard. The high-throughput contact and proximity exposure capabilities of EVG’s mask aligners, as well as its newly designed, unique, and extremely adaptable maskless exposure lithography systems, are the company’s primary competencies in lithographic technology. Resist coating and resist development systems, as well as superior in-house process competencies and hands-on development skills, complement the company’s strengths. The majority of EVG’s lithography equipment platforms are 300-mm compatible, can be completely integrated into EVG’s HERCULES® lithography track systems, and are accompanied by metrology instruments for top-to-bottom alignment verification.

EVG is the industry’s leading provider of nanoimprint lithography (NIL) equipment and integration services. NIL is the most promising and cost-effective method for producing nanometer-scale-resolution patterns for a wide range of commercial applications in bioMEMS, microfluidics, electronics, and diffractive optical components. Leveraging various research methods, EVG pioneered and perfected NIL more than 15 years earlier to implement volume production on various substrate sizes ranging from 2-inch compound semiconductor wafers to 300 mm wafers and even large-area panels. EVG’s recent solution, the EVG7300, integrates numerous UV-based processes into a single platform, including nanoimprint lithography (NIL), lens moulding, and lens stacking (UV bonding). This multipurpose industrial system may be utilized for a wide range of novel applications, including micro and nanopatterning and functional layer deposition, in both sophisticated R&D and manufacturing processes.

EVG has developed revolutionary next-generation lithography technology called the MLE (maskless exposure) technology to satisfy future back-end lithography demands for advanced packaging, MEMS, biomedical, and IC substrate applications. The world’s first fully scalable maskless lithography method for high-volume production offers unrivalled flexibility, allowing for incredibly fast device development cycles. The goal of EVG’s revolutionary MLE technology is not only to bring a new lithography tool to market but also to fulfil a fundamental demand in the semiconductor industry for smart and agile digital processing while enabling unique maskless scalability in throughput

EVG Adheres to its corporate social responsibility agenda demands that all suppliers comply with applicable legal requirements and regulations regarding occupational health and safety, equality, accident prevention, equipment safety, environmental protection, and anti-bribery
EVG uses an ISO 14001-compliant Environmental Management System to conduct all activities in an ecologically and socially responsible way and to develop environmentally and socially friendly practices. EVG consistently improves its environmental performance by carefully managing resources and energy and minimizing solid waste, emissions, and wastewater.