ERS electronic
A Thermal Management Specialist

ERS electronic is a leader in thermal management, pioneering innovative thermal wafer test technology to help clients deliver defect-free, durable, and safe semiconductors. From its first thermal chuck for wafer test built in 1970 to the robust AirCool® technology, the company has established its excellence in meeting clients’ varying needs.

Enriched with extensive experience and in-depth expertise, ERS is ideally positioned to raise the bar of semiconductor development with its wide range of patented and patent-pending innovations. Its thermal management technologies and custom solutions are crucial in managing equipment thermal thresholds.

ERS is best recognized for fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related, and manufacturing probing at lower operating costs with a minimal carbon footprint. Its newest product, ProbeSense™, allows accurate and automated ISO 17025-certified temperature measurement and calibration tailored for wafer probing.

Aiming to be “more than a machinemaker,” ERS follows a philosophy of developing solutions that enable the next breakthrough semiconductor technologies in the market. To that end, it focuses on listening to customers, understanding their needs, and developing custom solutions driven and made effective by the principles of physics, electronics, software, and system architecture.

“Unlike many others specializing in specific disciplines, like machinemaking, mechanical precision, or optics, we combine all of these capabilities in one system,” says Laurent Giai-Miniet, CEO of ERS. “We take an out-of-the-box approach in designing solutions that fit the semiconductor industry’s existing and emerging needs.”

ERS’s expertise entails advanced wafer-level packaging driven by its automatic debond system that separates wafer and carrier associated with debonding. It performs automated debonding for thermal release bonding agents followed by a thermal process that reduces and controls the warpage of debonded and reconstituted wafers. Over the years, ERS has developed a portfolio of sophisticated chucks solutions for various test requirements, including anti-magnetic, high thermal uniformity (HTU), high voltage, special vacuum designs, and ultralow noise for semiconductor companies.

“Our solutions are best fit for precision testing, helping clients align with the new normal of testing and calibrating semiconductors with more accuracy and uniformity— often down to 0.1°C, or even going into the milli Kelvin area,” says Klemens Reitinger, CTO of ERS. One of ERS’s key success factors is customer centricity, and the company bestows some of the credit for its innovations to customers who constantly push and keep it on its toes. It has often happened that ERS has been approached by a customer with a requirement that has never been achieved before and that other companies have declined to do. For instance, a customer needed to remove a thermal tape from reconstituted wafer and separate, or “debond”, it from a metal carrier for further processing. This led to the invention of the first-ever thermal debonding machine.

ERS also supported the client using its “shock-and-lock” technology that addresses “warpage”, a type of deformity that results from the thermal treatment of the wafer, under controlled conditions. The success of these technologies inspired ERS to launch a new product line for Fan-out Advanced Packaging, including the Automatic Debond Machine (ADM), a second strong pillar of growth for ERS.

ERS has witnessed significant business growth in the last five years, powered by unique and unparalleled thermal management technologies, a testimonial of its core competencies. ERS consistently strives to outgrow the market and continue to do what it does best, which is, thermal management solutions for the semiconductor industry.