Semiconductor Review Conferences

Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.

The North American Vehicle Glazing Innovation Summit will be held in Detroit, featuring 15+ expert speakers from leading OEMs, glass manufacturers, and Tier-1 suppliers. The agenda includes keynotes, interactive Q&A, and panel discussions focused on emerging technologies, system integration, and sustainable innovation. The summit offers a high-level platform to share insights and shape the future of automotive glass.

PCB east has trained designers, engineers, fabricators and, lately, assemblers on making printed circuit boards for every product or use imaginable. More than 2,000 designers, fabricators, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™.

The Wafer-Level Packaging Symposium will bring together the foremost experts in the semiconductor industry to examine all aspects of wafer-level packaging, 3D device packaging, advanced manufacturing, and testing technologies.

ECTC is the only event that offers an outstanding array of packaging technology information and four full days of engaging seminars. The over 350 technical papers cover advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, quantum electronics, flexible and printed electronics.

For more than 30 years PCB West has trained designers, engineers, fabricators and, lately, assemblers on making printed circuit boards for every product or use imaginable. More than 2,500 designers, fabricators, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss.

Thermal Management Expo brings together senior engineers and decision makers with suppliers of thermal systems and materials to discuss the latest innovations and solutions for thermal management across automotive, aerospace & defense, energy/energy storage, telecom/5G, electronics, and medical applications. It’s the only free-to-attend exhibition and conference dedicated to the thermal engineering sector.

SEMICON West attracts the largest international media participation of any industry event in the world, with virtually every major industry publication and many global business media companies represented. Learn more about our Media Partners.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.