Thermal Management Expo 2022

Aug 29 - 31, 2022, Cleveland, Ohio,

Thermal Management Expo brings together senior engineers and decision makers with suppliers of thermal systems and materials to discuss the latest innovations and solutions for thermal management across automotive, aerospace & defense, energy/energy storage, telecom/5G, electronics, and medical applications. It’s the only free-to-attend exhibition and conference dedicated to the thermal engineering sector.

Semiconductor

Semicon West 2022 Hybrid

Jul 12 - 14, 2022, San Francisco,  CA

SEMICON West attracts the largest international media participation of any industry event in the world, with virtually every major industry publication and many global business media companies represented. Learn more about our Media Partners.

Semiconductor

Electronic Components and Technology Conference

May 31 - Jun 3, 2022, San Diego, CA

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Semiconductor

COINNOVATECS 2022

May 12 - 13, 2022, Monterey, California

CoInnovateCS is an interactive event that fosters collaboration and innovation across the compound semiconductor supply chain by exploring industry-led, next-generation challenges and opportunities.

Semiconductor

Wafer-Level Packaging Symposium

Feb 15 - 17, 2022, San Jose, CA

The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements, something which has never happened before. Previously System Architects designed circuits around package limitations because pushing package technologies outside of their “comfort zones” often led to undesirable results. With the rise in transistor costs and the need to improve power efficiency, Silicon Architects have little choice but to push advanced package technologies well beyond their comfort zones.

Packaging