Brian Chang, CEO
As the world moves into the 5G era, the commercialization of artificial intelligence (AI), high performance computing (HPC), and autonomous vehicles has become more mature and complicated. With upcoming technologies favoring test extremities, it is important to tackle test conditions such as high temperature, high speed, high pin count, and fine pitch applications. These 5G, the internet of things (IoT), AI, and HPC applications require more robust hardware to carry out frontend wafer testing and back-end system level test procedures. This is where Chunghwa Precision Test Tech (CHPT) grabs the spotlight as one of the leading and fastest growing providers of semiconductor test interface products, ranked among the top 11 global semiconductor probe card companies in 2020. Originally a high-speed PCB team within Chunghwa Telecom Research Institute, the company has started its own independent operations by drawing upon its ingrained knowledge in high-speed layout design. CHPT becomes a crucial player in not only innovating its hardware devices to match these demands, but also offering personalized post-sale service to work with clients on debugging and optimization.
CHPT currently has more than 70 percent of the market share in the probe PCBs and substrates sectors for smartphone test application processors chips—the trend of today’s 5G, AI, and high performance processors.
In addition, CHPT also manufactures boards used in network communication, automotive electronics, and other niche products. “We work closely with the world leaders in the semiconductor industry to stay on top of the technological trend. In recent years, we focus on vertical probe card MEMS solution for SoC markets and have quickly become the top 3 provider worldwide,” says Brian Chang, CEO of CHPT USA. CHPT continues to develop various needles to tackle PCIE Gen 5 and 112 Gbps PAM4 needs.
What distinguishes CHPT from its competitors is its ability to offer an all-in-house service to produce tailored products for clients. Chang explains that traditionally, clients needed to outsource their designers and manufacturers separately, resulting in inevitable loss of transportation, time, and communication. Furthermore, it was difficult to clarify issues and liabilities in repairs and debugging. To resolve these pain points, CHPT integrated design, manufacturing, assembly, and post-sales service to meet time to market and time to volume demands. The company also introduced automated and smart manufacturing processes to its lines to increase productivity and shorten lead times. “As we continue to grow our businesses and services, we have established international branches in China, Japan, and the U.S. to better service our local clients. CHPT-Santa Clara, CA branch is one of our critical centers, and it is undergoing office and lab expansions to fully embody probe card repair and assembly services by the end of 2022,” informs Chang.
We work closely with the world leaders in the semiconductor industry to stay on top of the technological trend. In recent years, we focus on vertical probe card MEMS solution for SoC markets and have quickly become the top 3 provider worldwide
Backed by an excellent research and development team that plays an important part in its probe card, substrate, and probe head developments, CHPT’s accomplishments in 2020-2021 included advancing 8 um copper clad lamination, producing and testing its own MEMS, and passing product verification for smartphone application chips, HPC chips, network communication chips, PMIC, and RF chips. CHPT is also working on high-speed needles that are at engineering and mass production stages. Chang notes, “The future of technological developments is endless, and CHPT hopes to continue to be a reliable partner in every step of the way!”