ASMPT: Global Semiconductor Packaging And Assembly Experts

Follow ASMPT on :

Robin Ng, Group CEO, ASMPTRobin Ng, Group CEO
ASMPT has a simple but compelling vision: "enabling the digital world". Previously known as ‘ASM Pacific Technology’, ASMPT is the largest solutions provider for semiconductor and electronics manufacturing. Headquartered in Singapore, listed in Hong Kong, and with numerous innovation centres, manufacturing facilities, and sales & service offices around the world, ASMPT has been helping its customers achieve higher productivity, reliability, and quality for decades.

ASMPT’s comprehensive range of solutions truly link the entire semiconductor packaging and assembly value chain. Its diverse portfolio ranges from wafer-level to die-level high-accuracy placement tools and SiP placement tools and addresses a broad range of packaging technologies such as 2.5D, 3D-IC, Fan-in, Fan-out Wafer-Level, and SiP.

ASMPT’s customers span the globe across many industries. They use ASMPT’s tools to organise, assemble, and package delicate electronic components into a vast range of end-user devices that go into computers, servers, smartphones, wearables, LED displays, and more.

“We give our customers the ability to create and make the digital products that anchor all of modern society. When you use a phone, a modern car, the latest computers, smart wearables, healthcare devices at doctors or hospitals, smart homes, or Internet computing, chances are that our solutions enabled the manufacture of the electronic chips or components in those items,” explained Mr. Robin Ng, Group CEO, ASMPT.

ASMPT’s two main business segments - Semiconductor Solutions (SEMI) and Surface Mount Technology Solutions SMT) - offer products and solutions across mainstream, applicative, and advanced tools. This comprehensive capability gives ASMPT the ability to moderate the cyclical revenue and profitability trends that are quite typical in semiconductor and electronics manufacturing. ASMPT is progressively creating conditions for sustained structural revenue growth and margin expansion, building a robust and enduring foundation for a bright and sustainable future for the company and its various stakeholders.

Backed by Committed, Comprehensive R&D

ASMPT’s solutions leadership is in no small part due to its consistent commitment to devoting around a significant proportion of its equipment revenue to R&D. Over time, this has enabled them to build a deep R&D talent pool and comprehensive in-house processes, development capabilities and expertise.
This has been necessary in order to keep up with ever-increasing demands for quality, efficiency, digitalization, automation, machine learning, and more.

One noteworthy feature of ASMPT’s R&D organization is its Enabling Technologies Group (ETG) that focuses on core competency development in key areas such as vision, motion, and vibration. This focus is integral to helping address the important challenges ASMPT’s customers face. The company also collaborates strongly with industrial and academic institutions as it develops many of its advanced technologies, always remaining open to cooperation with good partners for the benefit of its customers.

“With our commitment to R&D and partnership with customers for success, we are progressively weaving software solutions into our mix of offerings, both through targeted acquisitions and organic development,” added Mr. Ng.

The ‘Artificial Intelligence of Things’ Approach

ASMPT has also developed a robust Artificial Intelligence of Things or ‘AIoT’ approach that involves infusing AI capabilities into ‘smart assembly lines,’ enabling equipment to independently examine data, analyse it, make decisions, and to act based on those decisions. The core of its AIoT approach is a software engine that utilizes advanced machine learning algorithms to process manufacturing data to enable predictive maintenance and procedure tweaks for improving equipment uptime and yields.

When you use a phone, a modern car, the latest computers, smart wearables, healthcare devices at doctors or hospitals, smart homes, or Internet computing, chances are that our solutions enabled the manufacture of the electronic chips or components in those items


The AIoT approach has the potential to help significantly reduce human error, most notably in activities like sampling and quality assurance that were traditionally performed quite randomly or in an ad hoc manner. An AIoT approach can help companies achieve 100 percent sampling automatically and mitigate product errors at source to prevent costly product recalls, enabling clients to increase productivity and quality, while reducing unplanned downtime. ASMPT is progressively integrating AIoT solutions into its broad product portfolio in order to deliver such capabilities.

This is a nascent area for ASMPT, but it is confident that its small but growing software business will progressively deliver significant value to customers and positively impact other areas of the business, including the potential to evolve into a key business of its own in time.

The ‘Open Automation’ Concept

ASMPT collaborates closely with clients to understand their needs and develops solutions, taking into consideration the voice of the customer.

A great example is its ‘Open Automation’ concept for electronics manufacturing that considers different customers’ needs in the manner and pace of their factory automation journey. ASMPT has enabled its automation solutions to be implemented flexibly and modularly, and able to integrate third-party or retrofitted solutions.

This can be seen in ASMPT’s development of the world's first self-learning Solder Paste Inspection (SPI) inline expert system - a combination of the industry-leading SPI system Process Lens and the expert software WORKS Process Expert. Based on open, standardized protocols that enable third-party systems integration, this expert system learns from every printing and assembly process via collecting and evaluating all relevant data from production lines. This "Big Data + Machine Learning" capability enables better insights, greater efficiency, and quality, but above all, full autonomous control, and optimization of the printing process. Built on Open Automation principles, implementation can be done in four separate steps that take the system to a new and higher level of automation, depending on a customer’s schedule.

Harnessing Robust Organic Growth, Smart Acquisitions, and Partnerships

In early 2021, ASMPT began a series of strategic growth initiatives across the company that are unfolding in distinct phases over several years.
  • We are harnessing a combination of robust organic growth, smart acquisitions, and key partnerships to build out our portfolio to address customer and technology needs


For ASMPT’s mainstream and applicative businesses, these initiatives encompass targeted product enhancements that will solidify its leadership position and provide meaningful expansion into targeted adjacent markets.

For ASMPT’s advanced tools business, these will involve widening its technological leadership, primarily through intensifying R&D investment and steering resources into key areas. This includes growing in emerging markets with high-potential solutions, such as HBM , advanced display technology, advanced placement and MCM bonding solutions, and high-performance computing.

“We are harnessing a combination of robust organic growth, smart acquisitions and key partnerships in order to build out our portfolio to address customer and technology needs,” explains Mr. Ng. “Our approach to inorganic growth—acquisitions and partnership—distinctively complements our strong in-house capabilities. We always seek to invest ‘ahead of the curve’ to capture opportunities in growth areas, and we have a strong record of successful integration.”
Share this Article:
ASMPT

Company
ASMPT

Headquarters
Singapore

Management
Robin Ng, Group CEO

Description
ASMPT provides a wide range of solutions that truly link the entire semiconductor packaging and assembly value chain; in this sense, ASMPT can be considered ‘The Total Interconnect Company.’ Its diverse packaging portfolio spans wafer-level to die-level high-accuracy placement tools and SiP placement tools, addressing a broad range of packaging technologies

"When you use a phone, a modern car, the latest computers, smart wearables, healthcare devices at doctors or hospitals, smart homes, or Internet computing, chances are that our solutions enabled the manufacture of the electronic chips or components in those items"

- Robin Ng, Group CEO