Agileo Automation
Decoupling Software and Hardware Dependencies for Seamless Semiconductor Fabrication

Semiconductor factories typically house a range of equipment from different vendors. Advanced connectivity standards developed by the Semiconductor Equipment Materials Initiative (SEMI) help maintain the interconnectivity between these machines and the fab IT and are integral in managing processes like cluster tools and automating carrier delivery within manufacturing floors. They also require personnel with specialized equipment engineering and software development expertise to implement diverse tools successfully.

Agileo Automation simplifies equipment integration for OEMs with its industrial automation solutions and services catering to SECS/GEM and GEM300 implementations across various semiconductor production settings.

The company offers IT consultancy, software development, robot integration and programming, SECS/GEM and GEM300 consulting, programmable logic controllers (PLC) programming, and Open Platform Communications Unified Architecture (OPC UA) consulting. Addressing challenges like lead time constraints, hardware-software coupling, and customer integration needs, Agileo enhances productivity, reduces time to market, and achieves operational excellence.

"With our extensive global experience and knowledge of equipment commissioning, we can swiftly provide the right answers and save our customers valuable time and effort," says Marc Engel, CEO at Agileo Automation.

Every client engagement begins with a well-defined objective, providing them with a clear understanding of the project goal and timeline, regardless of their equipment specification plan. This is backed by the Agileo Automation Equipment Controller Framework (A²ECF), a software framework for process and metrology equipment control that allows multiple team members to simultaneously work on different tasks, accelerating progress toward numerous project targets.

The company initially uses simulators to prioritize partial hardware integration based on hardware (such as wafer robot loader or load port) lead time before transitioning the implementations to equipment hardware, enabling clients to proactively identify and resolve potential issues or limitations.

From a software perspective, it first delivers functional software with limited features and then through thorough planning, ensures frequent demonstrations and timely collection of client feedback. These agile processes aid the company to concurrently address hardware connectivity, user interface, and final customer expectations.

Agileo conducts integration tests with a fabrication plant's (fab) IT system, including the manufacturing execution system (MES also known as Host or EAP), before tool shipment. This approach emphasizes early risk management, promptly resolving potential issues, and developing comprehensive use cases that showcase the software's capabilities.

Combined with the company’s methodology, A²ECF provides crucial support to enable hardware simulation of fab equipment, minimizing software development time by decoupling it from hardware availability and dependency. In the absence of hardware, A²ECF drives software development, validation, and user interface design to progress in parallel. This facilitates timely maintenance, particularly for customers transitioning from lab environments to semiconductor fabs.

Understanding the specific constraints within fabs, Agileo tailors user interfaces to simplify task execution for operators, ensuring the creation of a seamless UI focused on task-oriented efficiency. In the currently distributed semiconductor industry, where equipment commissioning is often required across multiple regions, the ability to validate software modifications and perform regression testing without excessive travel is paramount. This is precisely what Agileo delivers.

One of its notable success stories involves a customer facing lead time challenges due to tight coupling between hardware and software components. By leveraging the A²ECF Semi framework, they could quickly source machinery from different suppliers and configure them seamlessly. This significantly improved their production lead time, eliminating the bottlenecks driven by tightly linked software and hardware components.

Successes like this can be attributed to the expertise and methodology of its founding associates, who possess over 20 years of experience as semiconductor equipment manufacturers. This background instills an OEM mindset within the company, making Agileo a comprehensive solution instead of a conventional software provider. Today, its commitment to expertise, customer-centric solutions, and innovative methodologies strengthens the company’s role in transitioning semiconductor manufacturing to industry 4.0.

Moving forward, as the semiconductor industry evolves, Agileo aims to remain at the forefront, driving innovation and delivering unmatched value.