6 JUNE 2021Interest in 3D semiconductor packaging is on the ascent. This is inferable from a few practical preferences of 3D semiconductor packaging when contrasted with ordinary choices. Additionally, the rising inclination for power-effective arrangements is having a beneficial outcome on 3D semiconductor packaging. It is exceedingly best in class and aids in improving the exhibition of the circuit execution. Expanded use in shopper hardware is primarily boosting the selection of 3D semiconductor packaging. Simultaneously, the developing scaling down pattern in hardware planning and assembling is making new roads for market players. AI chips today can contain multiple processors to achieve maximum parallelism, resulting in enormous die size. This presents a huge challenge for thermal and high voltage power management in which a custom cooling solution may be required. This creates opportunities for packaging vendors to develop products withthe thinner form factor and less thermal dissipation for a more cost-effective solution.Though technology tends to be rapidly changing in the modern age, semiconductor packaging tends to move a bit more slowly, at a more incremental pace. It does not indicate that changes will not occur, but it does take into account a primary need for reliability out in the field. The longer a semiconductor and its package will be required to be in service or how critical the application is, the more conservative the technology. Good examples are the types of semiconductor packages used in airplanes or automobiles compared to those in a mobile handset or television. Nonetheless, the industry is subject to external demands and regulations pushing for more rapid changes in some cases.Let us know your thoughts!A New Era Dawns for Semiconductor PackagingJames PhillipsCopyright © 2021 SiliconMedia, Inc. All rights reserved. Reproduction in whole or part of any text, photography or illustrations without written permission from the publisher is prohibited. The publisher assumes no responsibility for unsolicited manuscripts, photographs or illustrations. Views and opinions expressed in this publication are not necessarily those of the magazine and accordingly, no liability is assumed by the publisher thereof.Editorial StaffAlex D'souzaRussell ThomasCatalina JosephManaging EditorRichmond smith*Some of the Insights are based on the interviews with respective CIOs and CXOs to our editorial staffVisualizerJaxon JaseContact Us:Email:sales@semiconductorreview.comeditor@semiconductorreview.commarketing@semiconductorreview.com June - 2021, Vol 02 Issue 03Published by SiliconMedia, Inc.To subscribe to Semiconductor ReviewVisit www.semiconductorreview.com Richmond smithManaging Editoreditor@semiconductorreview.com
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