Bell Electronics: Advanced Optoelectronics and Sensors Device Packaging

Dr. Armando S. Soriano, President, Bell ElectronicsDr. Armando S. Soriano, President
The Philippines have several large, global, and home grown enterprises that have invested significantly into the design and R&D of semiconductor solutions. According to a study by the Philippine Trade & Investment Center-San Francisco, the Philippines semiconductor and electronics manufacturing industries contributed 62% of total Philippine exports in 2020 at US$43 billion. As the covid-19 pandemic put a constraint on the semiconductor industry, the manufacturing and assembly process of devices and equipments has been curtailed to a great extent. With its highly skilled workforce and thought leaders at its helm, Bell Electronics is a firm that stands out among its competitors by meeting stringent client requirements in the region. The semiconductor manufacturing firm is equipped towards developing assembly processes and materials to support its customers’ product development efforts. In addition, the company focuses on equipment automation and upgrades to suit clients’ needs for high-volume manufacturing at low assembly costs.

Bell Electronics Corporation—an ISO 9001 and EMS 14000 certified semiconductor manufacturing solutions provider—houses a team of engineers experienced in handling various wafers synthesized from compounds such as: Silcon, Germanium, Gallium Arsenide Phosphide (GaAsP), Lead Sulfide Crystal (PbS), Indium Phosphide (InP), Indium Gallium Arsenide (InGaAs), and Gallium Phosphide (GaP).
While the company initially specialized in metal can packaging, its solutions portfolio has since expanded to incorporate different forms of optoelectronics and sensor device packaging (TO can packaging, complex sub-assemblies, moulded plastic packages and other advanced packaging). Additionally, Bell Electronics is focused on developing the next generation of semiconductors, assembly processes, and automations that can accelerate customers’ product development efforts while meeting benchmarks for high-volume manufacturing at low assembly costs and rapid delivery lead times.

Customers in the semiconductor manufacturing space usually face several hurdles when producing devices in small volumes. However, Bell Electronics caters to all customer needs irrespective of volume requirements, allowing the semiconductor manufacturing firm to assemble devices for a variety of sectors, including automotive, medical, and communication. With customized solutions for each industry— designed for shorter delivery times, lower costs, and, most importantly, consistent quality of services—the company has gained a large number of loyal customers.

Additionally, to adequately meet customer demands and industry standards, Bell Electronics Corporation is focused on providing every employee with the necessary training and understanding and the resources and motivation to produce exemplary results. “Our company stands out because we focus on employee development training programs and we have set high benchmarks for candidate skill sets,” expresses Dr Armando S. Soriano, the President of the corporation.

A case study that stands testament to the flexibility of Bell Electronics’ solutions is its interaction with a client when the manufacturing and delivery of products to customers came to a halt due to the Covid-19 restrictions. In its obligation to consistently support the customers in solving their challenges even at the height of the pandemic, Bell Electronics selected 30 employees to work within the office premises for over two months. Adhering to all health protocols with a limited volunteer workforce, the Bell Electronics team met the customers’ requirements without compromising quality.

In its endeavours to continually stay ahead of the curve, the company aims to focus on closer collaboration with customers regarding the wafer fabrication process. Observing the increasing need for VCSEL (vertical-cavity surface-emitting laser) application in various industries, Bell Electronics is poised to expand its manufacturing capacity for optoelectronics products. “Our main goal is to further expand within the country and undertake an IPO in the next couple of years,” concluded Dr Armando.
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Bell Electronics

Company
Bell Electronics

Headquarters
Laguna, Philippines

Management
Dr. Armando S. Soriano, President

Description
The semiconductor manufacturing firm is experienced in handling various wafers like Gallium Arsenide Phosphide (GaAsP), Lead Sulfide Crystal (PbS), Indium Phosphide(InP), Indium Gallium Arsenide (InGaAs), Gallium Phosphide(GaP), Silicon, Germanium. The company initially specialized in metal can packaging but has since expanded to include different forms of optoelectronics and sensor device packaging (moulded plastic packages and other advanced packaging). Bell Electronics is focused on developing assembly processes and materials to help customers’ product development efforts. In addition, the company focuses on equipment automation and upgrades to suit clients’ needs for high-volume manufacturing at low assembly costs.