Contributor Network | Semiconductor Review Magazine| pageno: 2

Contributors

Sustainability, a Megatrend in the Packaging Industry

Adam Pawlick, Vice President of Engineering, Wells Enterprises

One of the first trends that present a manufacturing challenge is customization. More and more brands and customers...

Challenge Accepted! Problem-Solving Examples for Packaging Dilemmas

Matthew Ressner, Vice President of Manufacturing, Alcami Corporation

Foremost, packaging has to protect the product from degradation and damage. Material compatibility, water activity,...

The Future of Semiconductor Test

David Hall, Chief Marketer, Semiconductor , Head of Semiconductor Marketing at National Instruments

We are seeing a trend among semiconductor companies of modernizing their labs and changing their approach to...

Evolution toward 5G Multi-Tier Networks

Hank Kafka, VP-Access Architecture and Devices, AT&T

5G networks are expected to build on and extend the architectural concepts....

Staying In The Loop By Letting Go (A Little)

Jeremy Campbell, CIO, Electric Power Research Inst

Digitalization offers benefits to almost every area of business, and digital ideas come from all over.

Unit-Level Traceability for Automotive Customers

Dr. Ajay Sattu, Sr. Manager, Automotive Strategic Marketing, Amkor Technology, Inc.

While there is a high demand for traceability, the biggest challenge remains in identifying the protocols for manufacturing data across the supply chain.

The Opportunities and Challenges of an Integrated Approach to Engineering Systems

Ron Watson, Director, Engineering Systems and Processes, Xylem Inc

Computer-Aided Design (CAM) and Computer-Aided Manufacturing (CAM) and merchandise Data Management (PDM) had primarily captured the eye of producing companies

How the Semiconductor Industry Will Transform the Next Wave of Emerging Technologies

David Britz, New Business Development, Applied Materials

Much of the public discussion in technology focuses on megatrends in software and applications.

Addressing Engineering Challenges of Increasingly Complex Automobiles

Sandeep Sovani, Global Director-Automotive Industry, ANSYS

Advancements in automotive technology are widely transforming the complex automobiles that are undergoing redesign process.

Machine Learning Now at the Forefront of Embedded Applications

Mark Papermaster, CTO, and SVP Technology and Engineering, AMD

Machine Intelligence (MI) is actually a subsequent breakthrough in computing. They will leverage historical and real-time data and increasingly deploy machine learning (ML) algorithms