Contributors

New Platform for Multimodal Spectroscopic Characterization of Semiconductors

• Francis C. Ndi, Product Line Manager, HORIBA

Our Wireless World: How Wi-Fi 6 will seamlessly Integrate with 5G to Help Keep us Connected

• David Haynes, Vice President, Specialty Technologies for Lam Research's Customer Support Business Group (CSBG)

How IP brings technological innovation to life

• Kristof Beets, Vice President of Technology Insights, Imagination Technologies

New Ip Strategies For The Digital Economy

• Andreas Iwerbac, Director Group Technology & IP IntelligenceHusqvarna Group

Open Innovation

• Joseph Codispoti, Chief Intellectual Property Counsel at BEDGEAR

Making the Switch from Prototyping to Production

• Bob Yancey, Business Development Director, Hexcel

Revitalizing Electronics through Advanced Technology

• Simona Pappalardo, Senior Director, Global Product Organization APQP and Manufacturing Quality, Whirlpool Corporation

Demystifying Iiot and its Value to Manufacturing

• Craig Zedwick, Director Production Excellence and Automation, Cabot Microelectronics

Power over Ethernet (PoE) for Industry 4.0: Delivering Power to Ethernet Devices Via Data Lines

• Thomas Brand, Field Applications Engineer, Analog Devices

Forging the Pathway to New - Wave Semiconductor

• Kevin Kettler, Corporate Vice President, Boyd