The International Integrated Circuit Innovation Expo (IICIE 2026) will be held from 9-11 September 2026 at the Shenzhen World Exhibition & Convention Center, China. As a comprehensive platform spanning the semiconductor value chain, IICIE provides essential support for foundational manufacturing processes. The expo emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and hybrid bonding heterogeneous integration—all essential for commercializing silicon photonics, CPO, and HBM memory.
Key Focus Areas:
• Materials & Equipment for Volume Production: Exhibitors will showcase SOI wafers, photoresists, specialized packaging substrates for silicon photonics, alongside critical equipment including lithography, etching, thin-film deposition, and optical coupling testing, comprehensively strengthening silicon photonics manufacturing capabilities.
• Advanced Packaging for Photonics Integration: Heterogeneous integration technologies like CoWoS, SoIC, hybrid bonding, and TSV stacking enable high-density co-packaging of photonic and electronic chips, directly driving CPO toward mature mass production.
• End-to-End Supply Chain Collaboration: Wafer fabrication and OSAT providers can connect onsite with CIOE's silicon photonics and optical module vendors, while providing stacking and packaging services to elexcon memory chip exhibitors. This builds an integrated supply network spanning IC processes → optoelectronic devices → memory chips, addressing critical industry challenges in process compatibility and manufacturing yield.
Featured IICIE 2026 Exhibitors:
• Wafer Fab & OSAT: BIWIN STORAGE, BYD SEMICONDUCTOR, DJEL, HLMC, MXTRONICS, NCAP CHINA, NEXCHIP, SKY CHIP INTERCONNECTION, SKY SEMICONDUCTOR, TONGFU MICROELECTRONICS, among others
• Semiconductor Equipment: ACM RESEARCH, ASPIRING, CETC, CMSEMICON, HUAYU SEMICONDUCTOR, HWATSING, JINGCE ELECTRONIC, LONGYOUDE, MAXWELL, MITUTOYO, NAURA, NCATEST TECHNOLOGIES, PIOTECH, SHENYANG HEYAN TECH, SKYVERSE, U-PRECISION, specializing in lithography, etching, and inspection technologies
• Materials: ANJI MICROELECTRONICS, KONFOONG MATERIALS, NATIONAL SILICON INDUSTRY GROUP (NSIG), PERIC SPECIALTY GASES, SHANGHAI IC MATERIALS RESEARCH INSTITUTE, SHANGHAI SINYANG, XILONG SCIENTIFIC, UPERMASK, supplying wafers, targets, specialty gases, and other critical materials
• Core Parts: HIWIN, KINGLAI GROUP, SIASUN, VACREE, ZHONGKE INSTRUMENTS, highlighting core parts and advanced manufacturing solutions
Three Mega-Shows, One Massive Impact
IICIE 2026 will run concurrently with CIOE (China International Optoelectronic Exposition) and elexcon (Shenzhen International Electronics & Embedded Expo). Together, the three shows cover 340,000 square meters, bring together over 5,000 exhibitors, and are expected to attract more than 240,000 professional visitors. This powerful convergence connects semiconductors, optoelectronics, and embedded electronics, enabling cross-sector collaboration and creating a high-impact ecosystem for industry-wide exchange.
With three shows under one roof, attendees can explore the entire value chain in one go from chips - devices - modules - solutions - applications. Exhibitors can connect with key players ranging from IDMs, fabless, fabs, and OSATs to downstream sectors including AI, consumer electronics, automotive, communications and computing, displays, optoelectronics, and energy. For attendees, one badge unlocks all three shows, making it the most efficient way to explore the entire industry ecosystem.