8 NOVEMBER 2023IN MYPINIONPackaging electronic power devices is as important as the technology that goes to its making. As electronic devices continue to become more advanced and perform increasingly complex functions, the power module packaging design and development is playing a critical role by providing the necessary solutions to address stringent demands for higher power density, thermal management, and electrical performance of electronic devices.As demand continues to increase, the designers are pushing the boundaries to create next-generation power module packaging to meet the evolving needs of various industries. This puts a lot of pressure on both IDM and OSAT with package design capability to provide cost efficient package solutions.Approaching Innovation and Staying Ahead of Competition in a Rapidly Changing MarketConstant upgrading of design and development capabilities in CAE tools in mechanical, thermo-mechanical modelling, and simulation to adapt to complex design for enhanced performance products that are being introduced in a short period of time. Simulation provides right by design products that reduce overall design time and reduce the need for physical prototyping.Allocating resources for dedicated research and development efforts to explore new technologies, materials, and processes. Investment in new process technologies in the prototype assembly line and design verification capabilities are essential to enable early detection of design flaws and prevention of costly prototype iterations. With such capabilities, creating a design that realizes a manufacturable and testable product in a fast and efficient manner ensures our customers to achieve time to market goal while ensuring a reliable and high-performance package design.Regular engagement with customers to understand their pain points, challenges, and product roadmap coupled with market analysis to understand industry trends and emerging technologies provide insights to develop and maintain our own technology roadmap for potential areas of innovation and identify gaps in the market that we can capitalize on.By Cherie Sasan, Head, Design and Development, PhilippinesRAPIDLY MOVING MARKET OF SEMICONDUCTOR PACKAGING
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