GPM Corp: One-Stop-Shop For Semiconductor Packaging Process

These semiconductor products must undergo complex product development procedures to fulfill strict technical and business requirements. That makes the planning and strategy aspect of development vital. Technology (devices and package side) progress in the semiconductor industry has powered designers and manufacturers with resources to develop highly complex semiconductor products. These technological advancements have enabled much smaller and portable semiconductor-powered products than ever before.


Enter GPM Corp.

With more than 40 years of experience, GM Corp is committed to the field of smart manufacturing, building a smart machinery platform, providing consulting, research and development, smart equipment, and related equipment for semiconductor packaging processes. The company was established in 1978 with its own “GPM” brand, which was listed on the Taiwan Stock Exchange in 1998. At the beginning of its establishment, it focused on the manufacture of mold components for semiconductor equipment. Since 1985, it has gradually stepped into the field of process equipment, automation equipment, and precision mold components.

Under the able leadership of Chen Cheng-Hsing, chairman of GPM Corp, the company shows extensive experience in integrated circuit (IC) manufacturing, testing equipment, and mold development. The company is not only able to master
the independent key technologies for fast, stable, and accurate IC picking, placement, and molding but also assist customers in innovating manufacturing processes and developing equipment. Furthermore, to strengthen their core competitive advantage, GPM Corp provides a one-stop-shop for design, manufacturing, assembly, and testing functionalities.

What’s more? GPM Corp, with its core technology, is committed to the development of new manufacturing processes and equipment-leading technology. The company fully grasps the technical advantages and market opportunities, and provides flat panel display, 3D display, touch panel, and intelligent equipment with the highest production efficiency.

The GPM Corp offerings, however, don’t end here. For many years, the company has been directly involved in the development and manufacturing of precision machinery and equipment. With the rise of diverse application needs such as smart devices and onboard devices, GPM Corp has been guided by the nuclear technology that has been built for many years to provide high-precision IC substrate flats. Along with self-developed equipment, such as surface grinders, AOI inspection machines, the company also provides smart automation and effective product quality control or process improvement to increase production capacity and meet customer needs.
  • GPM Corp has been guided by the nuclear technology that has been built for many years to provide high-precision IC substrate flats


Having already set itself apart with its innovative business model and a range of robust solutions, GPM Corp is now gearing its focus on enhanced intelligence for production and manufacturing capabilities of solid process technology, and to successfully enter the core supply chain of key industries such as LCD, PV, PCB, biomedicine, robotics, intelligence, and product sales. Besides, the company is also poised to expand to new markets. For the coming months, therefore, the company is expected to showcase continuous advancement of smart equipment, and semiconductor packaging processes.
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Company
GPM Corp

Headquarters
Hsinchu city, Taiwan

Management
Chen Cheng-Hsing, Chairman

Description
With more than 40 years of experience, GPM Corp is committed to the field of smart manufacturing, building a smart machinery platform, providing consulting, research and development, smart equipment, and related equipment for semiconductor packaging processes