Christian Ohde, Director Semiconductor and Functional Electronic Coatings and Harald Ahnert, President Electronics
As technology nodes continue to shrink, the argument for "line and space" requirements has become increasingly demanding, especially regarding reliability and yield upon scaling. Increasing precision, uniformity, and contamination control requirements in today's electronic devices are constantly driving the need for efficient and low-cost chip packaging processes in both consumer and industrial applications. At the same time, a maximum of sustainability needs to be met during all manufacturing steps. Atotech, a market leader in advanced electroplating solutions and specialty chemicals technology, is leveraging its integrated systems approach to deliver chemistry, equipment, software, and services to satisfy a multitude of demands within the electronics key component production space. As a driver of the "information age" value chain, Atotech's technologies and service capabilities support diverse industrial and consumer-grade end-markets, such as smartphones, computing, data storage and servers, automotive manufacturing, household appliances, heavy machinery, and more.
"Our comprehensive systems-and-solutions approach leverages our unique offering of chemistry, equipment, and service. In our industry, we are the only major company to provide chemistry and equipment combined. Utilizing our equipment in connection with our tailored chemistry brings our customers significant value," elaborates Harald Ahnert, President Electronics at Atotech.
Headquartered in Berlin, Germany, Atotech has over 4,000 employees in more than 40 countries, with manufacturing operations across Europe, the Americas, and Asia. The company strives to stay on the cutting edge of innovation by significantly focusing its investments on its extensive R&D network and state-of-theart global TechCenters, which are the backbone of its success.
With its established R&D capabilities and industry-leading global TechCenter network, Atotech delivers best-in-class solutions combined with real-time on-site technical support and training for over 8,000 customers worldwide. The company not only focuses on supporting existing products and short-term R&D requirements but also collaborates with customers in proactive product development to improve quality, reduce overall costs, and increase the efficiency of next-generation technology. Acting as a one-stop surface-finishing solutions partner, Atotech uses its own in-house expertise network and extensive process know-how to conduct cutting-edge analytics and material science investigation that help to understand the mechanisms of metal deposition on a molecular level. The company utilizes advanced computer-assisted simulations and the prediction of molecular structures and functional groups to obtain desired deposition properties.
"We are a technology leader for various applications and industries as we offer a unique set of chemical processes, equipment, software, and services combined under one roof, providing significant value for our customers," adds Harald Ahnert, President Electronics at Atotech.
Atotech is a key supplier to the Semiconductor Industry. It’s effective process solutions can for example be seen in the areas of power semiconductors and advanced packaging. The electroless metallization processes, that are needed for best-inclass interconnections via wire bonding, soldering or sintering lead to highest reliability power semiconductor chip packages. This technology is vital for many products of a broad range of industries (e.g., automotive). Another example for Atotech’s technological leadership can be found in fine line Redistribution Layer (RDL) plating for Fan-Out Wafer-Level Packaging (FOWLP). The application requires the highest purity and ductility of copper RDL/ μ-vias to reduce the influences of thermal stress. Additionally, the process’ filling capabilities must ensure optimal via stacking and interlayer contact. In achieving this, Atotech's high purity Spherolyte® U F3 process for fi ne l ine R DL plating e nables u sers to improve operational performance with high reliability for next generation packaging needs. Spherolyte® U F3 i s s pecifically designed for plating sub 5 μm lines and large copper pads while simultaneously enabling via filling – thus targeting the needs of next generation semiconductor packages. In both segments – power semiconductors and FOWLP – Atotech is providing leading solutions, products and services to the semiconductor industry.
We are a technology leader for various applications and industries as we offer a unique set of chemical processes, equipment, software, and services combined under one roof, providing significant value for our customers, adds Harald Ahnert
Over the years, the company has built an extensive portfolio of 2,400 active patents and trademarks. "Atotech is constantly striving to develop new processes and equipment to help customers optimize performance and reduce costs while ensuring greater sustainability," says Christian Ohde, Director of Semiconductor and Functional Electronic Coatings. An in-house regulatory team frequently reviews the company's operations to minimize its environmental impact and ensure commitment to best practices in all aspects of Environmental, Social, and Governance (ESG) factor reporting. Building on its success, Atotech strives to maintain its leading position as a surface-finishing solutions provider and specialty chemicals company. The company aims to implement strategic investments to advance its product offering and expand its operations across the globe by working out the synergy between chemistry, equipment, software, and service to support nextgeneration product development.